Objective Industrial need is given for high performing materials in electronic packaging systems as well as in other electronic and electrical systems for devices working under high current densities and high thermal load. The project's aim is to develop new Carbon fibre reinforced Copper matrix composites whereby the thermal expansion is controlled and the thermal conductivity is enhanced. Besides a high stiffness and very good electrical conductivity is also expected. The unique combination of the low and adaptable coefficient of thermal expansion with extraordinary high thermal conductivity will make the material useful for heat sinks applications, in particular for electronics (Hybride Modules, Electronic Relays) and for electrically conducting springs. The envisaged material and its use are expected to give the European Industry in this field a lead for e.g. miniturizing electronics. For that purpose 3 possible production routes (Powder Metallurgy, Diffusion Bonding of Cucoated fibres, Infiltration of C fibre preforms with Copper melt) will be developed and be brought from laboratory to demonstrator scale. Suitable test pieces will be characterized with respect of their properties and investigated in demonstrator tests at the end users. Final evaluations about efficiency and economics are expected for outlining and initiating a "new product" line. In the projects are involved 6 partners from 4 different EU members, 2 partners from CCE countries will participate additionally with essential contributions. Fields of science natural sciencesphysical scienceselectromagnetism and electronicsengineering and technologymaterials engineeringcompositessocial scienceseconomics and businesseconomicsengineering and technologymaterials engineeringmetallurgy Programme(s) FP4-BRITE/EURAM 3 - Specific research and technological development programme in the field of industrial and materials technologies, 1994-1998 Topic(s) 0201 - Materials engineering Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator AUSTRIAN RESEARCH CENTERS SIEBERDORF EU contribution No data Address 2444 SEIBERSDORF Austria See on map Total cost No data Participants (5) Sort alphabetically Sort by EU Contribution Expand all Collapse all Degussa AG Germany EU contribution No data Address 60040 Frankfurt-am-Main See on map Total cost No data Fraunhofer-Gesellschaft zur Förderungder Angewandten Forschung e.V. Germany EU contribution No data Address 28,Winterbergstrasse 28 1277 Dresden See on map Total cost No data New Metals and Chemicals Ltd United Kingdom EU contribution No data Address Highbridge Street EN9 1DF Waltham Abbey See on map Total cost No data SIEMENS AG Germany EU contribution No data Address 50,Siemensdamm 50 13629 Berlin See on map Total cost No data Thomson-CSF Microelectronique France EU contribution No data Address 29,Avenue Carnot 91349 Massy See on map Total cost No data