Industrial need is given for high performing materials in
electronic packaging systems as well as in other
electronic and electrical systems for devices working
under high current densities and high thermal load.
The project's aim is to develop new Carbon fibre
reinforced Copper matrix composites whereby the thermal
expansion is controlled and the thermal conductivity is
enhanced. Besides a high stiffness and very good
electrical conductivity is also expected. The unique
combination of the low and adaptable coefficient of
thermal expansion with extraordinary high thermal
conductivity will make the material useful for heat sinks
applications, in particular for electronics (Hybride
Modules, Electronic Relays) and for electrically
conducting springs. The envisaged material and its use
are expected to give the European Industry in this field
a lead for e.g. miniturizing electronics.
For that purpose 3 possible production routes (Powder
Metallurgy, Diffusion Bonding of Cucoated fibres,
Infiltration of C fibre preforms with Copper melt) will
be developed and be brought from laboratory to
demonstrator scale. Suitable test pieces will be
characterized with respect of their properties and
investigated in demonstrator tests at the end users.
Final evaluations about efficiency and economics are
expected for outlining and initiating a "new product"
In the projects are involved 6 partners from 4 different
EU members, 2 partners from CCE countries will
participate additionally with essential contributions.
Funding SchemeCSC - Cost-sharing contracts
EN9 1DF Waltham Abbey