Objectif Industrial need is given for high performing materials in electronic packaging systems as well as in other electronic and electrical systems for devices working under high current densities and high thermal load. The project's aim is to develop new Carbon fibre reinforced Copper matrix composites whereby the thermal expansion is controlled and the thermal conductivity is enhanced. Besides a high stiffness and very good electrical conductivity is also expected. The unique combination of the low and adaptable coefficient of thermal expansion with extraordinary high thermal conductivity will make the material useful for heat sinks applications, in particular for electronics (Hybride Modules, Electronic Relays) and for electrically conducting springs. The envisaged material and its use are expected to give the European Industry in this field a lead for e.g. miniturizing electronics. For that purpose 3 possible production routes (Powder Metallurgy, Diffusion Bonding of Cucoated fibres, Infiltration of C fibre preforms with Copper melt) will be developed and be brought from laboratory to demonstrator scale. Suitable test pieces will be characterized with respect of their properties and investigated in demonstrator tests at the end users. Final evaluations about efficiency and economics are expected for outlining and initiating a "new product" line. In the projects are involved 6 partners from 4 different EU members, 2 partners from CCE countries will participate additionally with essential contributions. Champ scientifique natural sciencesphysical scienceselectromagnetism and electronicsengineering and technologymaterials engineeringcompositessocial scienceseconomics and businesseconomicsengineering and technologymaterials engineeringmetallurgy Programme(s) FP4-BRITE/EURAM 3 - Specific research and technological development programme in the field of industrial and materials technologies, 1994-1998 Thème(s) 0201 - Materials engineering Appel à propositions Data not available Régime de financement CSC - Cost-sharing contracts Coordinateur AUSTRIAN RESEARCH CENTERS SIEBERDORF Contribution de l’UE Aucune donnée Adresse 2444 SEIBERSDORF Autriche Voir sur la carte Coût total Aucune donnée Participants (5) Trier par ordre alphabétique Trier par contribution de l’UE Tout développer Tout réduire Degussa AG Allemagne Contribution de l’UE Aucune donnée Adresse 60040 Frankfurt-am-Main Voir sur la carte Coût total Aucune donnée Fraunhofer-Gesellschaft zur Förderungder Angewandten Forschung e.V. Allemagne Contribution de l’UE Aucune donnée Adresse 28,Winterbergstrasse 28 1277 Dresden Voir sur la carte Coût total Aucune donnée New Metals and Chemicals Ltd Royaume-Uni Contribution de l’UE Aucune donnée Adresse Highbridge Street EN9 1DF Waltham Abbey Voir sur la carte Coût total Aucune donnée SIEMENS AG Allemagne Contribution de l’UE Aucune donnée Adresse 50,Siemensdamm 50 13629 Berlin Voir sur la carte Coût total Aucune donnée Thomson-CSF Microelectronique France Contribution de l’UE Aucune donnée Adresse 29,Avenue Carnot 91349 Massy Voir sur la carte Coût total Aucune donnée