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Content archived on 2024-06-10

Laser patterning of 3d shaped structures

Objective


- 5 and 6 - axis excimer laser processing prototype machine built and demonstrated.

- prototype system for 3-Dlaser drilling of aerofoils.

- Multi-layer conformal pcb laser-based process route demonstrated, including software, on developable substrates.

- 4-layer conformal antenna PCB demonstrator fabricated on 6-axis tool.

- Novel 3-D Cu etching machine for 3D shaped Printed Circuit Board PCB developed by a third party from specifications (investment not funded by the project).

- printer head prototypes and antenna demonstrator produced on 5-axis tool.

- New laser processing know-how for the materials used in the project.

- Application study to replace UV lamp, light-house exposure in the lithographic steps of CRT production with multi-axis excimer laser exposure, avoiding long lead times associated with the complex lens assembly in the light house.
There is a strong industrial need of high precision patterning on 3D preformed structures such as:
printed circuit structures, including multilayer interconnections, molded circuits, sensors and antennae,
machined metal foils such as porous surfaces (aerofoils) or
photoimaging tools,
TV display CRT tubes.
Present imaging or structuring techniques have a limited potential to be adapted to 3D surfaces and currently limit pattern precision. Laser beams offer higher flexibility and versatility for the patterning of complex shapes.
The objective of this project is to develop:
(i) a real 3D laser patterning system having the following
characteristics:
high power lasers (Excimer, CO2 and Nd:YAG)
computer controlled workpiece and/or beam handling
beam forming and image plane/focal point position control across a 3D shaped substrate
process viewing and monitoring and end point detection.
CAD machine interface
(ii) a 3D electronic CAD tool capable of designing 3D multilayer Printed Circuits and of generating numerical data to the patterning system.
It is intended in this project to penetrate the domain of 100 mm features (lines and holes) to be patterned on 3D components having a maximum area of 1 square meter and minimum radius of curvature of 50 millimeters. This will be validated on several test structures.
The consortium comprises a manufacturer of laser systems (Exitech) and a supplier of CAD softwares (BSO) which will produce and promote respectively the system and the CAD tool, a technological institute specialised in automation and laser systems (RTM), several industrial companies and SMEs involved in the above applications (Thomson CSF, Thomson Tubes & Displays, Olivetti, British Aerospace and Moulded Circuits), and a laser application center (IREPA).

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CSC - Cost-sharing contracts

Coordinator

Thomson-CSF
EU contribution
No data
Address
Domaine de Corbeville
91404 GOMETZ LA VILLE
France

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Total cost

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Participants (8)

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