CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.
Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .
Resultado final
A novel multi-layer 3-D PCB laser-based process route has been developed where all critical process steps have been experimented and demonstrated on planar test vehicles, and then optimised and refined to fulfil the requirements for processing real 3D parts, particularly on the procedures and the equipment features.
A set of design rules has been defined for designing 3-D PCB on Cadence/Allegro in accordance with laser process performances, as well as specific ablation parameters to be used by the laser workstation for relevant drilling or writing laser operations.
A full process sequence for 3-D parts involves typically the following sequential steps :
1) Conformal shaping of initial 3-D substrate (polymer as basic material)/ developable shape.
2) Laser via hole drilling (if required by circuit structure) / Excimer laser.
3) Copper platting (surface treatment, chemical & electrolytic Cu ).
4) Conductor layer x.
-ED resist deposition.
-Laser patterning (insulation or conductor patterns) / Excimer.
-3-D Cu etching ( ground or large conductor layer), resist stripping.
Or
-SnPb mask, resist stripping, 3-D Cu etching, SnPb removal (routing layer).
-Dielectric lamination on 3D substrate (thin film polyimid )
-From there, identical to step 2 for processing the different layers
Such a process has a wide potential for the fabrication of complex 3-D shaped multi-layer PCB mainly dedicated to conformal antennas.
The circuit prototype investigated for validating the studies on multi-layer 3D PCB process, as well as the 6-axis laser system prototype and the software interfaces, is a demonstrator of an active reflector used in the realisation of a 3D shaped active antenna (Reflect-array). Dipoles are etched at the surface of the circuit, and the impedance of each dipole depends on the state of PIN diodes connected to it. The phase of the reflected beam (and then the direction of the reflected beam) is directly monitored by the impedance of the dipoles, and as a consequence by the state of the diodes.
This 3D antenna PCB demonstrator (DEM1) is derived from a flat 8-layer PCB reflect-array prototype originally composed of a 14 x 28 dipole array implemented on a 8-layer PCB. DEM1 is implemented on a 4-layer 3D PCB, where the basic dielectric material (PEI) is shaped as a truncated cylinder with a pseudo-parabolic curvature. The radiating front of DEM1 integrates only the equivalent function of a 10 x 14 dipole array. Overall part dimensions are roughly 300x260x50 mm
The layer structure is as follows:
-Top : Radiating front (convex side of 3.2 mm initial PEI substrate).
-Int2 : Internal layer / ground reference (concave side of the substrate).
-Int3 : Internal layer /routing (concave).
-Bottom Mounting /routing on digital side (concave).
Four different via-holes types (throughholes or µ-vias ) are implemented to interconnect the different conductor layers through the PEI and/or thin dielectric laminates.
IREPA Laser developed an acoustic process control system. This system was validated for drilling of polymers and ablation of resist with an excimer laser. The system runs correctly but needs to be adapted for different applications and materials.
IREPA Laser obtained an extensive amount of new data about excimer-, Nd:YAG- and CO2 laser processing of materials for micro-electronics applications. Some of the materials machined (via drilling, resist ablation are compatible with 3-D printed circuit board technology.
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