Design of an Ultra-stiff actively controlled Nano-positioning system for HSCh and ELID grinding applications

Información del proyecto

DUNE

Identificador del acuerdo de subvención: BRPR970526

Proyecto cerrado

Fecha de inicio 1 Octubre 1997

Fecha de finalización 30 Septiembre 2000

Financiado con arreglo a

• Specific research and technological development programme in the field of industrial and materials technologies, 1994-1998

Coste total

Sin datos

Aportación de la UE

Sin datos

Coordinado por

KATHOLIEKE UNIVERSITEIT LEUVEN
Belgium

Objetivo

The DUNE project developed piezo-driven modules for translation and rotation with a hybrid position, speed, and force control. They were combined in a two-dimensional planar stage with a stroke of 100 mm. In the four remaining degrees-of-freedom, the stage can be positioned over a short stroke. The stage represents a completely new drive concept where drive and bearing are combined and where two planar motions are integrated.
The stage has excellent dynamic properties making it actively stiff and controllable to 100 Hz. The stage has a positioning resolution down to 10 nm. The passive stiffness of the stage is in the order of 200 N/µm. The active stiffness, for disturbing forces having a frequency content smaller than 50 Hz is 450 N/µm. Note that the above given figures depend on design parameters of the positioning system. These design parameters can be altered to meet the specific needs of a given application. The prototype system was tested under realistic loads. Cutting forces previously recorded on an ELID ductile grinding experimental set-up are applied through shakers on the system. The position deviation of the stage under influence of the disturbance forces proves to lie within 20 nm, which corresponds to the proposed specifications. It is the aim to continue this research after the DUNE project in order to come to an industrial ELID ductile grinding machine.

The DUNE project also developed a high-speed spindle for ductile material removal. The grinding wheel has a diameter of 100 mm and a spindle rotational speed of 100 000 rpm can be reached. This allows cutting speeds up to 500 m/s. With this spindle, a new concept for ductile material removal, called High Speed Chipping (HGA), has been studied. While material removal (partially in ductile state) has been obtained, the process requires further investigation to gain a full understanding of the material removal process. The project also developed a design for a hydrostatic slide with a new kind of structured bearing pad to be combined with the high speed chipping process. This slide can be an alternative for the piezo-driven stage described above, however offering only the stiffness and not the nano-positioning capabilities.
Objectives and content
For the finishing of many industrial products additional
polishing is needed to obtain minimal surface roughness
and to get rid of sub-surface damage. Polishing is a
time consuming/ expensive process, often introducing
intolerable workpiece shape inaccuracies.
Recently, very useful new grinding methods, like
Electrolytic In-process Dressing grinding and High need
Chipping (HSC) for material removal have become available
which potentially combine an accurate surface shape
control with high removal rates, high surface quality,
and no sub-surface damage. These new grinding methods
feature no loading of the grinding tool and neither
burning of the workpiece. However, they require a (highspeed) rotating abrasive tool. Ductile grinding can be
obtained for all kinds of materials such as metal, glass,
and ceramics. The conditions for ductile grinding
require sub-micron-tracking control of the movement of
the rotating tool in all directions relative to the
workpiece. Existing grinding machines are not accurate
and stiff enough. To be able to make use of the
advantages for the ductile grinding methods, a new ultra
stiff actively controlled nano-positioning system for HSC
and ELID grinding has to be developed, eliminating
backlash, stick-slip, and rolling resistance.
The project will develop piezo-driven modules for
translation and rotation with a hybrid position, speed,
and force control. The HSC process will be further
improved and tested on the developed positioning system.
Thanks to the sub-micron accuracy and the infinite active
stiffness it will be possible to replace the widely used
polishing process by ductile grinding.

Ámbito científico (EuroSciVoc)

• ingeniería y tecnología › ingeniería de materiales › sólidos amorfos
• ciencias médicas y de la salud › medicina básica › neurología › accidente cerebrovascular
• ingeniería y tecnología › ingeniería de materiales › cerámica

Palabras clave

• Nanotechnology

Programa(s)

• FP4-BRITE/EURAM 3 - Specific research and technological development programme in the field of industrial and materials technologies, 1994-1998

Tema(s)

• 0101 - Incorporation of new technologies into production systems

Convocatoria de propuestas

Datos no disponibles

Régimen de financiación

CSC - Cost-sharing contracts

Coordinador

KATHOLIEKE UNIVERSITEIT LEUVEN

• Aportación de la UE: Sin datos
• Dirección: 300 B,Celestijnenlaan 300 B ; 3001 HEVERLEE ; Bélgica
• Coste total: Sin datos

Participantes (5)

Euro Precision Technology BV

Países Bajos

• Aportación de la UE: Sin datos
• Dirección: 305,Bedrijvenpark Twente ; 7602 KL Almelo
• Coste total: Sin datos

FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Alemania

• Aportación de la UE: Sin datos
• Dirección: Steinbachstrasse 17 ; 52074 AACHEN
• Coste total: Sin datos

NEDERLANDSE PHILIPS BEDRIJVEN BV

Países Bajos

• Aportación de la UE: Sin datos
• Dirección: 4,Professor Holstlaan 4 ; 5656 AA EINDHOVEN
• Coste total: Sin datos

Pöting GmbH & Co. Kommanditgesellschaft

Alemania

• Aportación de la UE: Sin datos
• Dirección: 38,Neanderstrasse ; 40699 Erkrath
• Coste total: Sin datos

W. Schneeberger AG

Suiza

• Aportación de la UE: Sin datos
• Dirección: St. Urbanstraße ; 4914 Roggwil
• Coste total: Sin datos