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Application of new bond and coat technology to advanced hybrid semiconductor power package devices to increase integrity, reduce costs and simplify design

Objective


The identified route to realising the objective was to manufacture semiconductor packages from the Transient Liquid Phase (TLP) bonding of high volume silicon carbide particulate loaded aluminium alloy Metal Matrix Composite (MMC). The deposition of the alumina substrate and copper tracks, prior to integration of the semiconductor components, was to be developed based upon the use of High Velocity Oxyfuel (HVOF) spraying.

At the closure point of the project the preferred MMC material had been procured and had undergone preliminary evaluation. This included initial TLP bonding trials using silver and copper at the interface. HVOF spraying had been successfully demonstrated for the deposition of copper tracks in a defined pattern onto the insulating alumina substrate and the HVOF spray deposition of alumina onto MMC coupons.

However, an assessment of the costs associated with the TLP bonding route for the fabrication of the semiconductor packages indicated that the process would not be economically viable. In addition, technical delays were encountered during the initial period in the development of the HVOF powders and the TLP bonding of the MMC to form demonstrator packages. At the mid-term point it was felt that, due to the above reasons, the objectives of the project could not be attained within the time and budget constraints of the CRAFT scheme. Hence the decision was taken to close the project at the mid-term.

Funding Scheme

CRS - Cooperative research contracts

Coordinator

OXLEY DEVELOPMENTS COMPANY LTD
Address
St. Thomas Street 35
SE1 9SN London
United Kingdom

Participants (7)

Curamik Electronics GmbH
Germany
Address
2,Am Stadtwald 2
92676 Eschenbach
GEC Plessey Semiconductors plc
United Kingdom
Address
Cheney Manor
SN2 2QW Swindon
Gesellschaft für Energiespartechnik mbH
Germany
Address
6,Am Markt
24589 Nortorf
PRODUCTION ENGINEERING RESEARCH ASSOCIATION - PERA
United Kingdom
Address
Technology Centre, Nottingham Road
LE13 0PB Melton Mowbray
Phoenix Scientific Services Ltd.
United Kingdom
Address
Chaucer Industrial Estate
BN26 6JF Polegate
Suffolk Glass Associates Company Ltd.
United Kingdom
Address
Shire Hill Industrial Estate
CB11 3AQ Saffron Walden
THE WELDING INSTITUTE
United Kingdom
Address
Granta Park, Great Abington
CB1 6AL Cambridge