Objective A generic semiconductor package was defined in terms of design features and performance criteria. The development of aluminium alloy based powders, that could be subjected to Metal Injection Moulding (MIM) and sintered, was restricted to powders that contained 70% silicon carbide particulate. A proprietary binder system was developed to a point that facilitated the Metal Injection Moulding of trial samples of the Metal Matrix Composite (MMC). Technical delays were experianced in the development of a powder system that could be processed successfully by MIM and sintered to give a material that satisfied the required material properties, ie: with the presence of excessive porosity - which would not provide a hermetic encapsulation, and control of the material shrinkage to ensure accuracy of the finished near net shape part. These delays were incurred through an under appreciation of the high level of fundamental materials research required to progress the state-of-the-art to achieve the technical objectives that would result in the production of demonstrator near net shape encapsulations. By the mid-term point the delays in the original project programme were such that the objectives were not attainable within the time and budget limitations of the Craft scheme and the decision was taken to close the project. Fields of science natural scienceschemical sciencesinorganic chemistryinorganic compoundsnatural scienceschemical sciencesinorganic chemistrypost-transition metalsnatural sciencesphysical scienceselectromagnetism and electronicssemiconductivitynatural scienceschemical sciencesinorganic chemistrymetalloids Programme(s) FP4-BRITE/EURAM 3 - Specific research and technological development programme in the field of industrial and materials technologies, 1994-1998 Topic(s) Data not available Call for proposal Data not available Funding Scheme CRS - Cooperative research contracts Coordinator OXLEY DEVELOPMENTS COMPANY LTD Address St. thomas street 35 SE1 9SN London United Kingdom See on map EU contribution € 0,00 Participants (8) Sort alphabetically Sort by EU Contribution Expand all Collapse all Curamik Electronics GmbH Germany EU contribution € 0,00 Address 2,am stadtwald 2 92676 Eschenbach See on map GEC Plessey Semiconductors plc United Kingdom EU contribution € 0,00 Address Cheney manor SN2 2QW Swindon See on map Gesellschaft für Energiespartechnik mbH Germany EU contribution € 0,00 Address 6,am markt 24589 Nortorf See on map Metallico Pulverspritzguss GmbH Germany EU contribution € 0,00 Address Rosstrappenstrasse 06502 Thale See on map National University of Ireland, Cork Ireland EU contribution € 0,00 Address Prospect row 30 Cork See on map PRODUCTION ENGINEERING RESEARCH ASSOCIATION - PERA United Kingdom EU contribution € 0,00 Address Technology centre, nottingham road LE13 0PB Melton mowbray See on map Phoenix Scientific Services Ltd. United Kingdom EU contribution € 0,00 Address Chaucer industrial estate BN26 6JF Polegate See on map Suffolk Glass Associates Company Ltd. United Kingdom EU contribution € 0,00 Address Shire hill industrial estate CB11 3AQ Saffron walden See on map
