Objective
Today the joining process of integrated circuits (IC's) on the smart-card substrate is made with aluminium wire bonding or isotropic conductive adhesive joining. However, both these methods are not cost-effective. The wirebonding process requires a clean room facility and costly automatic bonding machines. Isotropic conductive adhesive joining requires, on the other hand, underfilling to obtain a strong and reliable joint. This is a time consuming process. Anisotropically conductive adhesive joining of IC's on smart-card substrates using fast UV- and heat curable conductive adhesives represents a new technology to obtain a low-cost and high speed joining technology. No underfilling operation is needed after the joining. The main objective of the project is to develop a new low-cost and reliable joining process of IC's on smart-card substrates using fast-curable anisotropically conductive adhesives. Photoinitiators will be used to initiate in-line cure before the IC placement and post cure off-line using heat and in dark cure in line after the IC placement. The goal is to reduce the production cost of the joined module by 50%. A vertical project group is planned consisting material, component, equipment and substrate supplier and end users. The partners come from Germany, The Netherlands, Finland, Switzerland and Sweden.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
422 49 Hisings - Backa
Sweden
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.