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SLICING OF VERY LARGE SIZE SQUARE MULTICRYSTALLINE SILICON WAFERS

Objective


It has been established that cell processing on 200 um thick 200 mm wafers is technically feasible. This dimension choice can result in improved fabrication productivity, not only in the cell processing, but also in all operations from ingot shaping and wafer slicing down to subsequent cell and module assembling. It will further improve the system reliability in high voltage and high power applications due to reduced interconnections. In the first set of test runs, small bricks (40 to 70 mm thickness) were sliced at a low table speed with good results in terms of yield and surface quality.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

E.N.E. SA - ENERGIES NOUVELLES ET ENVIRONNEMENT
Address
Avenue Van Der Meerschen 188
Bruxelles
Belgium