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Excimer laser lithography project for sub quarter micron era

Objective

- Provision of concepts for a 193 nm lithography tool.

- Development of a 193 nm excimer laser.

- Selection of optical materials for use in and predevelopment of a 193 nm projection system.

- Definition of user requirements for a production exposure tool.

- Resists predevelopment and evaluation.

The project links leading European materials and equipment suppliers and research institutes in the area of advanced lithography, being the first phase of a combined European effort to provide 193 nm lithography tools and resists for the Gigabit DRAM technology generations, i.e. for 0.18 and 0.12 micron feature sizes. The two main workpackages will focus on production exposure tool design and predevelopment and on a litho cell for 193 nm process development. The ultimate goal is to make available a European optical exposure tool and resist processes compatible with 0.18/0.12 micron manufacturing requirements by the year 2000.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

Grenoble Submicron Silicon
Address
Avenue Des Martyrs 17
38054 Grenoble 9
France

Participants (8)

Asm Lithography B.V.
Netherlands
Address
De Run, 110
5503 LA Veldhoven
CCLRC Rutherford Appleton Laboratory (RAL)
United Kingdom
Address
Chilton
OX11 0QX Didcot
Carl Zeiss
Germany
Address
Carl Zeiss-str. 4-54 4-54
73446 Oberkochen
Exitech Ltd
United Kingdom
Address
Hanborough Park
OX7 2LH Long Hanborough
HERAEUS QUARZSCHMELZE
Germany
Address
Quarzstraße 8
63450 Hanau
Interuniversity Microelectronics Centre
Belgium
Address
Kapeldreef 75
3001 Leuven
Korth Kristalle Gmbh
Germany
Address
Am Jaegersberg 3
24161 Altenholz
Lambda Physic Gesellschaft Zur Herstellung Von Lasern Mbh
Germany
Address
Hans-boeckler-strasse 12
37079 Goettingen