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Innovative thermo-mechanical prediction and optimisation methods for virtual prototyping of miniaturised electronic packages and assemblies

Objective

Integrated circuits play a vital role in ICT. The ongoing trend of miniaturisation and function integration is pushing technology from micro to nano scales. As a consequence, thermo-mechanical failures, accounting for 65% of the total failures and originating from the product/process design phase, will become even more critical Thus, innovative thermo-mechanical design of micro electronic packaging and assemblies, fivirtual thermo mechanical prototyping, is required to reduce cost and time-to-market and to design in reliability. The results will substantially enhance the efficiency, accuracy and capability of virtual thermo mechanical prototyping method. Exploitation will lead to improvement of thermo- mechanical reliability (1% higher yield) and reduced time-to market by at least 30%. This project consists of 4 scientific innovations verified by experiments including software, and virtual thermo mechanical prototyping as the technical innovation.

Call for proposal

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Coordinator

PHILIPS ELECTRONICS NEDERLAND B.V.
Address
Graslaan 2, Building Saq
5600 MD Eindhoven
Netherlands

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Participants (8)

AMIC ANGEWANDTE MICRO-MESSTECHNIK GMBH
Germany
Address
Volmerstrasse 9b
Berlin

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DELFT UNIVERSITY OF TECHNOLOGY
Netherlands
Address

2600 GA Delft

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FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
Address
Leonrodstrasse 54
80636 Muenchen

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KITRON DEVELOPMENT AB
Sweden
Address
Bataljonsgatan 10
SE 551 10 Joenkoeping

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LEUVEN MEASUREMENTS AND SYSTEMS INTERNATIONAL NV
Belgium
Address
Interleuvenlaan 68, Researchpark Haasrode
3001 Heverlee

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NETHERLANDS ORGANISATION FOR APPLIED SCIENTIFIC RESEARCH - TNO
Netherlands
Address
De Rondom 1
5612 AP Eindhoven

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THALES MICROELECTRONICS SA
France
Address
Bellevue Z.i.
35221 Chateaubourg

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WROCLAW UNIVERSITY OF TECHNOLOGY
Poland
Address
Janiszewskiego 11/17
50 372 Wroclaw

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