Objective
European SME packaging producers (around 6000 in EU) are under a continuous pressure of often-powerful (multinational) clients to meet constant changes in packaging designs and features. Current process equipment (rotary and punch tools) have limitations due to long delivery times of tools for design changes (e.g. 4 months for rotary tools) and high costs (50.000 Euro per design change) all leading to extremely low flexibility. The objective of the Hi-SLIDE project is to develop new laser-based process equipment for fully automated in-line cutting and creasing (a fundamentally new approach in the total processing system of packaging). Goal is to obtain complete freedom of (intermediate) design changes and to ban completely the problem of wear of the cutting tools. These innovations will result in radical improvements in flexibility, reduced time to market (50-80%), cost reduction (70%), high speed (300 metres/minute), accuracy (100% repetitively) and waste reduction (50%).
Fields of science
Call for proposal
Data not availableFunding Scheme
EAW - Exploratory awardsCoordinator
3133 KX VLAARDINGEN
Netherlands