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Contenu archivé le 2024-05-27

High speed bi-directional laser cutting and creasing of fast moving carton-board for packaging

Objectif

European SME packaging producers (around 6000 in EU) are under a continuous pressure of often-powerful (multinational) clients to meet constant changes in packaging designs and features. Current process equipment (rotary and punch tools) have limitations due to long delivery times of tools for design changes (e.g. 4 months for rotary tools) and high costs (50.000 Euro per design change) all leading to extremely low flexibility. The objective of the Hi-SLIDE project is to develop new laser-based process equipment for fully automated in-line cutting and creasing (a fundamentally new approach in the total processing system of packaging). Goal is to obtain complete freedom of (intermediate) design changes and to ban completely the problem of wear of the cutting tools. These innovations will result in radical improvements in flexibility, reduced time to market (50-80%), cost reduction (70%), high speed (300 metres/minute), accuracy (100% repetitively) and waste reduction (50%).

Appel à propositions

Data not available

Régime de financement

EAW - Exploratory awards

Coordinateur

MADERN GRAVEERINDUSTRIE EN GEREEDSCHAPPENFABRIEK B.V.
Contribution de l’UE
Aucune donnée
Adresse
Vikingbank 1
3133 KX VLAARDINGEN
Pays-Bas

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Coût total
Aucune donnée

Participants (1)