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Optical methodologies for interferometric strain measurement (OPTIMISM)

Objective

OPTIMISM addresses the customer-driven requirement for reliability in micro engineered product by developing a measurement methodology and instrument for component and package strain measurement. Strain is a major cause of failure in micro engineered products. The measurement method and instrument is of generic applicability across the sectors of micro-engineering, namely microelectronics, Microsystems, micro sensors hybrid optoelectronics systems and the packaging of these components. The scientific approach is based on the improvement of the state-of-the-art in the Moire interferometry and speckle interferometry techniques, and their integration in a single instrument to provide the most generic applicability to different sample types. A full 3-D strain mapping capability will be developed. The use of micro-optical engineering approaches including diffractive optics and optoelectronics sources, to miniaturize the instrument will be investigated.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

N/A

Participants (5)

3D PLUS SA
France
Address
421,Rue Helene Boucher 421 Zone Industrielle
78532 Buc
AMI SEMICONDUCTOR BELGIUM BVBA
Belgium
Address
Westerring 15
9700 Oudenaarde
OPTICAL METROLOGY INNOVATIONS LTD.
Ireland
Address
2200 Cork Airport Business Park
Co Cork
SENSONOR ASA
Norway
Address
Knudsroedveien 7
3192 Horten
UNIVERSITY OF NOTTINGHAM
United Kingdom
Address
University Park
Nottingham