OPTIMISM addresses the customer-driven requirement for reliability in micro engineered product by developing a measurement methodology and instrument for component and package strain measurement. Strain is a major cause of failure in micro engineered products. The measurement method and instrument is of generic applicability across the sectors of micro-engineering, namely microelectronics, Microsystems, micro sensors hybrid optoelectronics systems and the packaging of these components. The scientific approach is based on the improvement of the state-of-the-art in the Moire interferometry and speckle interferometry techniques, and their integration in a single instrument to provide the most generic applicability to different sample types. A full 3-D strain mapping capability will be developed. The use of micro-optical engineering approaches including diffractive optics and optoelectronics sources, to miniaturize the instrument will be investigated.
Funding SchemeCSC - Cost-sharing contracts