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Optical methodologies for interferometric strain measurement (OPTIMISM)

Objective

OPTIMISM addresses the customer-driven requirement for reliability in micro engineered product by developing a measurement methodology and instrument for component and package strain measurement. Strain is a major cause of failure in micro engineered products. The measurement method and instrument is of generic applicability across the sectors of micro-engineering, namely microelectronics, Microsystems, micro sensors hybrid optoelectronics systems and the packaging of these components. The scientific approach is based on the improvement of the state-of-the-art in the Moire interferometry and speckle interferometry techniques, and their integration in a single instrument to provide the most generic applicability to different sample types. A full 3-D strain mapping capability will be developed. The use of micro-optical engineering approaches including diffractive optics and optoelectronics sources, to miniaturize the instrument will be investigated.

Call for proposal

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Coordinator

N/A
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Participants (5)

3D PLUS SA
France
Address
421,rue Helene Boucher 421 Zone Industrielle
78532 Buc

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AMI SEMICONDUCTOR BELGIUM BVBA
Belgium
Address
Westerring 15
9700 Oudenaarde

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OPTICAL METROLOGY INNOVATIONS LTD.
Ireland
Address
2200 Cork Airport Business Park
Co Cork

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SENSONOR ASA
Norway
Address
Knudsroedveien 7
3192 Horten

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UNIVERSITY OF NOTTINGHAM
United Kingdom
Address
University Park
Nottingham

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