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DEMONSTRATION OF ECONOMIC AND RELIABLE MANUFACTURING PROCESSES FOR MULTICHIP MODULES USING INNOVATIVE COFIRING CERAMICS

Objective

The core of the LTCC technology is the green (= unsintered), tape cast ceramic foil. These green foils are mechanically shaped, screenprinted, laminated and cofired at 875 C to a complex ceramic multilayer substrate. The key element of lowering the prices is to increase the usable substrate size to > 6 x 6 inch and to increase integration density to > 600 interconnections per sq inch. A preliminary cost analysis showed reductions in material cost of 50% or more using this technique.

Innovative Low Temperature Cofirable Ceramics (LTCC) as the basic interconnection board can offer some important advantages including:

- complementary thickfilm processability
- application of Flip Chip mounted integrated IC's
- high speed Signal management
- EMC management.

The project was concerned with the use of multichip modules (MCMs) for electronic systems, which enables the placement of ICs to be closer to each other in order to improve electrical performance, to increase integration density, to reduce manufacturing costs and to reduce solder connections in order to improve reliability.

The demand for boards using this technology was expected to grow dramatically during the next 5 years. The objective of the project was to:

- offer interconnection and packaging technology adequate for a broad range of new products for European users
- offer new manufacturing processes of high efficiency and high accuracy in Europe.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

SIEGERT ELECTRONIC
Address
Pfannenstielstrasse 10
90556 Cadolzburg
Germany

Participants (3)

EKRA GMBH
Germany
Microtel
Italy
Address
Via G. Di Vittorio 5
20065 Inzago
Sorin Biomedica Cardio SpA
Italy
Address
Via Crescentino
13040 Saluggia Vercelli