Objective Many business objectives related to yield, performance, reliability or safety are functions of temperature (gradients). PROFIT aims to create methods and tools to enable a timely assessment of these objectives in all stages of the product creation process. Today's analyses are seriously hampered by the lack of methods to predict temperature gradients in time and space at package, board and system level with sufficient accuracy. The project aims to overcome these drawbacks by major improvements in experimental techniques to acquire input data, in non-linear parameter estimation methods and in transient thermal characterisation of components. Standardisation is considered an important deliverable. Ultimately, the results are suited for implementation in emerging virtual prototyping methods and physic-based reliability analysis software. Objectives:Safety, performance and reliability of electronic products are a function of temperature. Higher accuracy in temperature predictability gives better control of design and manufacturing. Higher-quality products have a positive impact on the product's life-cycle-cost and people's quality of life.Industrial problems:1. Cost/weight reduction with better quality2. Physics-based prediction of reliability3. Yield improvement of packages4. Awareness of problems due to the absence of useful design specs5. Standardisation of thermal characterisation.Solutions offered by PROFIT:1. Significant improvements in temperature prediction for virtual prototyping2. Accurate predictability of temperature gradients in time and space3. Better-defined rejection criteria based on in-line quality testing4. Dissemination of combined thermal expertise in EU through international contacts.Work description:The work will be directed towards major improvements in thermal analysis of the whole electronic design chain, from device via package and board to system. Important data required for accurate numerical analysis are lacking: interface resistances, emissivities, local boundary conditions and local board thermal conductivities, for which test setups will be built based on transient temperature measurements. Transient measurements at device and package level will be performed to assess their quality. Analysis of the data will be treated by using novel non-linear parameter estimation methods. Software will be improved, developed and integrated to facilitate the application of the project results in performance and reliability calculations. Various demonstrators showing the final deliverables are foreseen. The EU lead in thermal characterisation of steady-state compact models will be extended to the transient domain. Yearly workshops will be organised to promote discussion amongst experts, and to facilitate early standardisation.In short, the innovative elements are:- Novel statistical approach for the optimisation of experiments, analysis of transient data and generation of compact models.- Novel measurement techniques for the acquisition of input data.- Novel electrothermal and thermomechanical board/system level software.- New proposals for the standardisation of transient thermal characterisation.The Workpackages show clearly the required elements of the design chain: device, package, board, system. All parties needed to fulfil the objectives are in the consortium: semiconductor manufacturers, system makers, thermal software vendors, an SME focussing on statistics, a university specialised in electrothermal analysis and transient measurements, and a major research institution contributing in the fabrication of test dies and tool integration. Most partners have a long history in successful co-operation in related fields. Fields of science natural sciencescomputer and information sciencessoftwarehumanitieshistory and archaeologyhistorynatural scienceschemical sciencesanalytical chemistrycalorimetrynatural sciencesphysical scienceselectromagnetism and electronicssemiconductivitynatural sciencesmathematicsapplied mathematicsnumerical analysis Programme(s) FP5-IST - Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002" Topic(s) 1.1.2.-4.7.2 - Subsystems technologies Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator PHILIPS ELECTRONICS NEDERLAND B.V. EU contribution No data Address BOSCHDIJK 525 5621 JG EINDHOVEN Netherlands See on map Total cost No data Participants (9) Sort alphabetically Sort by EU Contribution Expand all Collapse all BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM Hungary EU contribution No data Address MUEGYETEM RAKPART 3 1111 BUDAPEST See on map Total cost No data CENTRE FOR QUANTITATIVE METHODS B.V. Netherlands EU contribution No data Address VONDERWEG 11 5600 AK EINDHOVEN See on map Total cost No data FLOMERICS LIMITED United Kingdom EU contribution No data Address 81 BRIDGE ROAD, HAMPTON COURT KT8 9HH SURREY See on map Total cost No data INFINEON TECHNOLOGIES AG Germany EU contribution No data Address ST. MARTIN STRASSE 53 81609 MUENCHEN See on map Total cost No data INSTITUT NATIONAL POLYTECHNIQUE DE GRENOBLE France EU contribution No data Address 46 AVENUE FELIX VIALLET 38031 GRENOBLE CEDEX 1 See on map Total cost No data MICRED MICROELECTRONICS RESEARCH AND DEVELOPMENT LTD. Hungary EU contribution No data Address GULYAS U 27 1112 BUDAPEST See on map Total cost No data NOKIA OYJ Finland EU contribution No data Address KEILALAHDENTIE 4 02150 ESPOO See on map Total cost No data PHILIPS SEMICONDUCTORS B.V. Netherlands EU contribution No data Address PROFESSOR HOLSTLAAN 4 5656AA EINDHOVEN See on map Total cost No data STMICROELECTRONICS S.R.L. Italy EU contribution No data Address VIA OLIVETTI 2 20041 AGRATE BRIANZA See on map Total cost No data
