Objective
In the ATOL project an international consortium will evaluate the production worthiness of the Atomic Layer Chemical Vapour Deposition (ALCVD) tool for barrier and Cu seed multilayer metal applications in CMOS013 manufacturing. The consortium will establish a list of specifications against which the performance of the tool will be compared to. Initially the components of the system-the TiN and Cu process modules- will be tested with regard to the uniformity and reproducibility of the thin film properties. In the second phase of the evaluation the performance of the whole system will be measured including throughput and Cost of Ownership (CoO).
Objectives:
The project will critically support the commercialisation of the Atomic Layer Chemical Vapour Deposition (ALCVD) tool of ASM microchemistry for barrier and Cu seed applications in the CMOS013 production. It will enable the tool manufacturer to enter the advanced metallisation tool market with a breakthrough system. This will be achieved by giving an international consortium the opportunity to test the tool at the assessment centre. The semiconductor chip manufacturers, taking part in this project, represent a wide range of products consisting of microprocessors and memory chips for personal computers, chips for telecommunications, for consumer electronics etc. Therefore, the tool will be exposed to demands from different product sectors. It also gives European chip manufacturers the possibility to take part in the assessment of a state-of-the-art technique, which will give them a competitive advantage in determining their metallisation strategy in time for the CMOS013 node.
Work description:
The project will be carried out in three different work packages with each package lasting 6 months. In work package 1 the tool assessment will be prepared. This includes establishing the specification targets by the consortium, against which the tool will be compared, the configuration of the tool at the vendors site, shipment, installation and basic qualification at the site of the assessment centre. In work package 2 the components of the tool, i.e. the process modules will be evaluated in terms of their production worthiness. The performance of the barrier module will be constrated to the specifications established in work package 1 by the consortium. Processes of Record (POR), which are proven to be materials compatible with a CMOS flow, will be installed on the process modules. The testing, which will mainly be done on blanket wafers, will evaluate the uniformity and reproducibility of the deposition of ALCVD TiN and Cu by measuring different thin film properties over a number of wafers. In work package 3 a unified approach to the assessment of the tool is taken. In this part the focus is on the optimisation of the throughput. An analysis of the throughput will reveal the bottlenecks and their impact on the throughput will be reduced. Among other parameters the throughput will eventually be fed into a Cost of Ownership (CoO) calculation of the ALCVD metallisation tool. It will provide the basis for a comparison between ALCVD and ionised-PVD. The latter is currently the industries standard. Furthermore, the performance of the ALCVD films will be evaluated on topography wafers. Meander/fork structures with critical dimensions of the CMOS013 node will serve as a test vehicle to determine the number of electrically active defects due to ALCVD TiN and Cu. The results will be contrasted to results obtained from ionised-PVD metallisation.
Milestones:
The assessment programme will yield a list of specifications the ALCVD tool has to achieve to demonstrate the reproduction worthiness for the CMOS013 device generation. The performance of the barrier and Cu seed modules will be contrasted to the specifications on the uniformity and repeatability of thin film properties and defect generation. The throughput of the system will be optimised in the course of the programme, which will result in Cost of Ownership evaluation of the ALCVD tool.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering computer hardware computer processors
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors optical sensors
- natural sciences chemical sciences inorganic chemistry post-transition metals
- engineering and technology materials engineering coating and films
- engineering and technology electrical engineering, electronic engineering, information engineering information engineering telecommunications
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
3001 LEUVEN
Belgium
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.