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Contenu archivé le 2024-05-27

Deposition Equipment for Flat Panel Display Fabrication

Objectif

The objective of the project is to assess a new prototype of plasma deposition machine and the related processes to deposit thin films needed for the fabrication of Flat Panel Displays.
The benefits are:
- Improved silicon dioxide on polycristalline silicon transistors by increasing the deposition temperature
- Improved insulators and ballast layers for Field Emission Displays
- Equipment compatibility for amorphous, polysilicon and Field Emission Displays.
These benefits will be achieved by assessing the UNAXIS equipment by two users THALES AVIONICS LCD and PIXTECH.

This project belongs to the key action IV.6.3 : Assessments actions in display manufacturing and will contribute to the SEA activity cluster.

Objectives:
The objective of the project is to assess a new type of plasma deposition equipment and the Related fabrication processes to deposit thin films needed for the fabrication of Flat Panel Displays by improving film homogeneity, exploring and optimising the base gas mixtures, and increasing the temperature range of deposition.

The expected advantages are:
1. To demonstrate polycristaline silicon transistors with lower flat band voltage (less than 1V) compatible with CMOS design and manufacturing of poly-Si AMLCDs (increase of the temperature is a key parametrer)
2. To deposit insulator and ballast layers for FED fabrication
3. To disseminate and exploit the production capability of the equipment to produce amorphous and polycristaline silicon for AMLCD and FED mass production

Work description:
THALES AVIONICS LCD will acquire the UNAXIS equipment and install it in their clean rooms, and assess it by the fabrication of silicon dioxide test plates to control the equipment performances like throughput and the material properties (e.g. flat band voltage) and defect density.

THALES AVIONICS LCD will also do:
- The fabrication of test vehicles including transistors, drivers and matrices to demonstrate the capability of the equipment for polysilicon AMLCD manufacturing.
- The fabrication of amorphous silicon AMLCDs with silicon dioxide storage capacitor layer.

PIXTECH will assess the quality of the insulator layers (both silicon nitride and silicon dioxide) and of the ballast layer (amorphous silicon-like) which are used in Field Emission Display manufacturing.
PIXTECH will also assess the quality of these materials by the fabrication of test vehicles and Field Emission Display demonstrators.

UNAXIS will participate to the installation of the equipment, special maintenance and optimisation of the equipment during the project at THALES AVIONICS LCD. It will contribute process optimisations at their R&D centre, in particular before the final installation of the equipment (preshipment test).
UNAXIS will transfer the technology validated at the beginning of the project in a production demonstration machine in Asia.

Dissemination of the results: all the partners will contribute to the following tasks:
1. Equipment specifications and capacibilites
2. Dissemination of the demonstrator results and research of other applications
3. Equipment capability demonstration for Flat Panel Display mass manufacturing

Milestones:
Month 3: Final specification of equipment
Month 5: Equipment installed and ready for the project
Month 15: Polycristalline silicon transistor and Field Emission Display insulators with the required characteristics
Month 21: Demonstration of the use of the equipment for the manufacturing of amorphous and polycristalline silicon transistor AMLCDs and FEDs.
Month 21 Process qualification in the equipment, dissemination and exploitation

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ACM - Preparatory, accompanying and support measures

Coordinateur

THALES AVIONICS LCD SA
Contribution de l’UE
Aucune donnée
Adresse
BOULEVARD HAUSSMANN 173
75008 PARIS
France

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