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DEVELOPMENT OF STRUCTURAL PARTICLE BOARDS, COMPLY AND OSB BOARDS, UTILIZING NEW GLUEING TECHNIQUES

Objective

RATIONAL UTILIZATION OF POOR KINDS OF WOOD
REDUCING THE APPARENT DENSITY OF BOARDS TO THAT OF SOLID WOOD
THE SAME STRENGTH CHARACTERISTICS AS KNOT-FREE SOLID WOOD
LOWER WATER IMBIBITION AND GREATER DIMENSIONAL STABILITY OF BOARDS
DEVELOPMENT OF NEW APPLICATIONS FOR STRUCTURAL CHIPBOARD, POSSIBLY AS A BASIC MATERIAL IN THE FORM OF BONDED WOODEN BOARDS OR AS STRUCTURAL ELEMENTS.

THE AIM OF THE RESEARCH IS TO TEST NEW BONDING SYSTEMS, GIVEN THE PRESENT STATE OF PRODUCTION TECHNOLOGY. IT IS PRIMARILY PLANNED TO USE MIXED-RESIN BONDINGS BASED ON PHENOL AND ISOCYANATE-MODIFIED AMINOPLASTIC MIXED-RESINS. AN ATTEMPT IS ALSO TO BE MADE TO FILL THE CAVITIES IN THE CHIPS BY MEANS OF ADDITIONAL FOAMING OF THE ADHESIVES AND TO OBTAIN HIGHER STRENGTH CHARACTERISTICS AND LOWER WATER IMBIBITION VALUES BY MEANS OF IMPROVED WETTING.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

Dansk Teknologisk Institut
Address
Gregersensvej
2630 Taastrup
Denmark

Participants (1)

BMA
Ireland
Address

Berlin