BASIC RESEARCH IN SOLDERING FOR SURFACE-MOUNTING TECHNOLOGY IN ELECTRONICS ASSEMBLY

Project Information

Grant agreement ID: RI1B0287

Project closed

Start date 1 June 1989

End date 31 May 1992

Funded under

• Multiannual research and development programme (EEC) in the fields of basic technological research and the applications of new technologies (BRITE), 1985-1988

Total cost No data

EU contribution No data

Coordinated by

National Physical Laboratory (NPL)
United Kingdom

Objective

A new measurement instrument for the solderability of surface mounting electronic components was developed and is now being exploited commercially. In addition, a test procedure and guidance document have been written for submission to the relevant international CEN and IEC standards committees. A semi-quantitative predictive model of component solderability was produced. The effect of component solderability on solder fillet shape and hence on joint reliability was investigated. A set of solder joint fatigue data was produced for the different component types and different soldering processes.

Programme(s)

• FP1-BRITE - Multiannual research and development programme (EEC) in the fields of basic technological research and the applications of new technologies (BRITE), 1985-1988

Topic(s)

Data not available

Call for proposal

Data not available

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

National Physical Laboratory (NPL)

• EU contribution: No data
• Address: Queen's Road ; TW11 0LW Teddington ; United Kingdom
• Total cost: No data

Participants (3)

Multicore Solders Ltd

United Kingdom

• EU contribution: No data
• Address: HP2 4RQ Hemel Hempstead
• Total cost: No data

Nederlandse Philips Bedrijven BV

Netherlands

• EU contribution: No data
• Address: 5600 MD Eindhoven
• Total cost: No data

SIEMENS AG

Germany

• EU contribution: No data
• Address: Wittelsbacherplatz 2 ; MUENCHEN
• Total cost: No data