Objective A new measurement instrument for the solderability of surface mounting electronic components was developed and is now being exploited commercially. In addition, a test procedure and guidance document have been written for submission to the relevant international CEN and IEC standards committees. A semi-quantitative predictive model of component solderability was produced. The effect of component solderability on solder fillet shape and hence on joint reliability was investigated. A set of solder joint fatigue data was produced for the different component types and different soldering processes. Programme(s) FP1-BRITE - Multiannual research and development programme (EEC) in the fields of basic technological research and the applications of new technologies (BRITE), 1985-1988 Topic(s) Data not available Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator National Physical Laboratory (NPL) Address Queen's road TW11 0LW Teddington United Kingdom See on map EU contribution € 0,00 Participants (3) Sort alphabetically Sort by EU Contribution Expand all Collapse all Multicore Solders Ltd United Kingdom EU contribution € 0,00 Address HP2 4RQ Hemel hempstead See on map Nederlandse Philips Bedrijven BV Netherlands EU contribution € 0,00 Address 5600 MD Eindhoven See on map SIEMENS AG Germany EU contribution € 0,00 Address Wittelsbacherplatz 2 Muenchen See on map Links Website Opens in new window
