A new measurement instrument for the solderability of surface mounting electronic components was developed and is now being exploited commercially. In addition, a test procedure and guidance document have been written for submission to the relevant international CEN and IEC standards committees. A semi-quantitative predictive model of component solderability was produced. The effect of component solderability on solder fillet shape and hence on joint reliability was investigated. A set of solder joint fatigue data was produced for the different component types and different soldering processes.
Funding SchemeCSC - Cost-sharing contracts
HP2 4RQ Hemel Hempstead
5600 MD Eindhoven