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Content archived on 2024-04-15

BASIC RESEARCH IN SOLDERING FOR SURFACE-MOUNTING TECHNOLOGY IN ELECTRONICS ASSEMBLY

Objective


A new measurement instrument for the solderability of surface mounting electronic components was developed and is now being exploited commercially. In addition, a test procedure and guidance document have been written for submission to the relevant international CEN and IEC standards committees. A semi-quantitative predictive model of component solderability was produced. The effect of component solderability on solder fillet shape and hence on joint reliability was investigated. A set of solder joint fatigue data was produced for the different component types and different soldering processes.

Topic(s)

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Call for proposal

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Coordinator

National Physical Laboratory (NPL)
EU contribution
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Address
Queen's Road
TW11 0LW Teddington
United Kingdom

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Participants (3)