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BASIC RESEARCH IN SOLDERING FOR SURFACE-MOUNTING TECHNOLOGY IN ELECTRONICS ASSEMBLY

Objective


A new measurement instrument for the solderability of surface mounting electronic components was developed and is now being exploited commercially. In addition, a test procedure and guidance document have been written for submission to the relevant international CEN and IEC standards committees. A semi-quantitative predictive model of component solderability was produced. The effect of component solderability on solder fillet shape and hence on joint reliability was investigated. A set of solder joint fatigue data was produced for the different component types and different soldering processes.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

National Physical Laboratory (NPL)
Address
Queen's Road
TW11 0LW Teddington
United Kingdom

Participants (3)

Multicore Solders Ltd
United Kingdom
Address

HP2 4RQ Hemel Hempstead
Nederlandse Philips Bedrijven BV
Netherlands
Address

5600 MD Eindhoven
SIEMENS AG
Germany
Address
Wittelsbacherplatz 2
Muenchen