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GaN densily integrated with Si-CMOS for reliable, cost effective high frequency power delivery systems


Dissemination, Communication and Exploitation campaigns report

The report will describe the dissemination, communication and exploitation campaigns throughout the project duration.


High Q -Factor PCB Embedded Flip-Chip Inductors With Multilayer CZTB Magnetic Sheet for Power Supply in Package (PwrSiP)

Author(s): Declan Jordan, Guannan Wei, Liang Ye, Daniel Lordan, Pranay Podder, Ansar Masood, Kenneth Rodgers, Cian O Mathuna, Paul McCloskey
Published in: IEEE Journal of Emerging and Selected Topics in Power Electronics, 9/1, 2021, Page(s) 102-110, ISSN 2168-6785
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/jestpe.2020.2983125

Characterization and enhancement of magnetic performance of electrodeposited Ni45Fe55 on PCB for high frequency application

Author(s): Z. Ghaferi, P. McCloskey
Published in: Journal of Magnetism and Magnetic Materials, 505, 2020, Page(s) 166708, ISSN 0304-8853
Publisher: Elsevier BV
DOI: 10.1016/j.jmmm.2020.166708

Printing GaN HEMTs onto silicon CMOS

Author(s): Stefan Eisenbrandt and Ralf Lerner
Published in: Compound Semiconductor Magazine, 2018, ISSN 1096-598X
Publisher: Institute of Physics Publishing

New Embedded Inductors For Power Converter Applications

Author(s): G. Weidinger, H. Stahr, A. Zluc, I. Salkovic, M. Schober, H. Takahashi, G. Weis, Ch. Vockenberger, S. Suchovsky
Published in: MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum”, 16-17 May, 2018, 2018
Publisher: MiNaPad

Considerations on the Design Methodology for an Integrated Gate Driver

Author(s): N. Fiebig, G. Fischer, P. Ostrovskyy, D. Kissinger
Published in: 16. GMM/ITG Fachtagung - Entwicklung von Analogschaltungen mit CAE-Methoden (ANALOG 2018), 2018, Page(s) 131-135, ISBN 978-3-8007-4754-2
Publisher: VDE Verlag

PCB embedding of Magnetic Material for Inductor-based Applications

Author(s): Gerald Weis, Ivan Salkovic and Gerald Weidinger
Published in: International Microelectronics Assembly & Packaging Society (iMAPS), 16th Annual Device Packaging Conference (DPC 2020), 2-5 March, 2020, 2020
Publisher: iMAPS

Qi compliant wireless charger with PCB integrated magnetic material

Author(s): Gerald Weis, Ivan Salkovic, Gerald Weidinger, Karl Kirchheimer, Ronald Sekavcnik, Johannes Stahr
Published in: 2019 IEEE Wireless Power Transfer Conference (WPTC), 18-21 June 2019, 2019, Page(s) 203-207, ISBN 978-1-7281-0705-9
Publisher: IEEE
DOI: 10.1109/wptc45513.2019.9055647

GaNonCMOS H2020 Research: Sub-25V Switch Technologies for use in PwrSiP and PwrSoC

Author(s): Odhran Reidy and Séamus O’Driscoll
Published in: MCCI Annual Meeting 2017, 2017, 2017
Publisher: MCCI