GaN densily integrated with Si-CMOS for reliable, cost effective high frequency power delivery systems

Project Information

GaNonCMOS

Grant agreement ID: 721107

DOI 10.3030/721107

Project closed

EC signature date 9 November 2016

Start date 1 January 2017

End date 30 June 2021

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Advanced materials

Total cost € 7 428 885,75

EU contribution € 6 246 064,50

Coordinated by

KATHOLIEKE UNIVERSITEIT LEUVEN
Belgium

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Deliverables

Documents, reports (1)

Dissemination, Communication and Exploitation campaigns report

The report will describe the dissemination, communication and exploitation campaigns throughout the project duration.

Publications

Peer reviewed articles (3)

High Q -Factor PCB Embedded Flip-Chip Inductors With Multilayer CZTB Magnetic Sheet for Power Supply in Package (PwrSiP)

Author(s): Declan Jordan, Guannan Wei, Liang Ye, Daniel Lordan, Pranay Podder, Ansar Masood, Kenneth Rodgers, Cian O Mathuna, Paul McCloskey
Published in: IEEE Journal of Emerging and Selected Topics in Power Electronics, Issue 9/1, 2021, Page(s) 102-110, ISSN 2168-6785
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/jestpe.2020.2983125

Characterization and enhancement of magnetic performance of electrodeposited Ni45Fe55 on PCB for high frequency application

Author(s): Z. Ghaferi, P. McCloskey
Published in: Journal of Magnetism and Magnetic Materials, Issue 505, 2020, Page(s) 166708, ISSN 0304-8853
Publisher: Elsevier BV
DOI: 10.1016/j.jmmm.2020.166708

Printing GaN HEMTs onto silicon CMOS

Author(s): Stefan Eisenbrandt and Ralf Lerner
Published in: Compound Semiconductor Magazine, 2018, ISSN 1096-598X
Publisher: Institute of Physics Publishing

Conference proceedings (11)

New Embedded Inductors For Power Converter Applications

Author(s): G. Weidinger, H. Stahr, A. Zluc, I. Salkovic, M. Schober, H. Takahashi, G. Weis, Ch. Vockenberger, S. Suchovsky
Published in: MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum”, Issue 16-17 May, 2018, 2018
Publisher: MiNaPad

Considerations on the Design Methodology for an Integrated Gate Driver

Author(s): N. Fiebig, G. Fischer, P. Ostrovskyy, D. Kissinger
Published in: ANALOG 2018; 16th GMM ITG-Symposium, Issue 13-14 September, 2018, 2018, Page(s) 131-135, ISBN 978-3-8007-4754-2
Publisher: VDE

Calculation, Simulation and Production of PCB-integrated Inductors with Focus on Fringing Effect

Author(s): Gerald Weis and Ivan Salkovic
Published in: PCIM Europe 2019, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2019, Page(s) 1-5, ISBN 978-3-8007-4938-6
Publisher: VDE

High Power Density DC-DC Converters Using Highly Integrated Half-Bridge GaN ICs

Author(s): Michael Basler, Stefan Moench, Richard Reiner, Fouad Benkhelifa, Gerald Weidinger, Gerald Weis, Rüdiger Quay, Ingmar Kallfass and Oliver Ambacher
Published in: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2021, Page(s) 1014-1021, ISBN 978-3-8007-5515-8
Publisher: VDE

PCB Embedded Transformer for Isolated DC-DC Power Supplies

Author(s): Gerald Weis and Ivan Salkovic
Published in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, Page(s) 1-5, ISBN 978-3-8007-5225-6
Publisher: VDE

PCB embedding of Magnetic Material for Inductor-based Applications

Author(s): Gerald Weis, Ivan Salkovic and Gerald Weidinger
Published in: International Microelectronics Assembly & Packaging Society (iMAPS), 16th Annual Device Packaging Conference (DPC 2020), Issue 2-5 March, 2020, 2020
Publisher: iMAPS

Design of Low-Resistance and Area-Efficient GaN-HEMTs for Low-Voltage Power Applications

Author(s): Richard Reiner, Fouad Benkhelifa, Stefan Moench, Michael Basler, Patrick Waltereit, Michael Mikulla, Rüdiger Quay and Oliver Ambacher
Published in: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2021, Page(s) 401-408, ISBN 978-3-8007-5515-8
Publisher: VDE

Qi compliant wireless charger with PCB integrated magnetic material

Author(s): Gerald Weis, Ivan Salkovic, Gerald Weidinger, Karl Kirchheimer, Ronald Sekavcnik, Johannes Stahr
Published in: 2019 IEEE Wireless Power Transfer Conference (WPTC), Issue 18-21 June 2019, 2019, Page(s) 203-207, ISBN 978-1-7281-0705-9
Publisher: IEEE
DOI: 10.1109/wptc45513.2019.9055647

PCB Embedded Toroidal Inductor for 2MHz Point-of-Load Converter

Author(s): Ruaidhrí Murphy, Zoran Pavlovic, Paul McCloskey, Cian Ó Mathúna, Séamus O’Driscoll and Gerald Weidinger
Published in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, Page(s) 280-285, ISBN 978-3-8007-5225-6
Publisher: VDE

GaNonCMOS H2020 Research: Sub-25V Switch Technologies for use in PwrSiP and PwrSoC

Author(s): Odhran Reidy and Séamus O’Driscoll
Published in: MCCI Annual Meeting 2017, Issue 2017, 2017
Publisher: MCCI

Thin-film magnetics-on-silicon integrated transformer for isolated power conversion applications

Author(s): Zoran Pavlovic, Pranay Podder, Dermot Dobbyn, Ansar Masood, Guannan Wei, Daniel Lordan, Paul McCloskey, Cian O’Mathuna and Séamus O’Driscoll
Published in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, Page(s) 264-268, ISBN 978-3-8007-5225-6
Publisher: VDE