GaN densily integrated with Si-CMOS for reliable, cost effective high frequency power delivery systems

Project Information

GaNonCMOS

Grant agreement ID: 721107

DOI 10.3030/721107

Project closed

EC signature date 9 November 2016

Start date 1 January 2017

End date 30 June 2021

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Advanced materials

Total cost € 7 428 885,75

EU contribution € 6 246 064,50

Coordinated by

KATHOLIEKE UNIVERSITEIT LEUVEN
Belgium

Deliverables

Documents, reports (1)

Dissemination, Communication and Exploitation campaigns report

The report will describe the dissemination, communication and exploitation campaigns throughout the project duration.

Publications

Peer reviewed articles (3)

High Q -Factor PCB Embedded Flip-Chip Inductors With Multilayer CZTB Magnetic Sheet for Power Supply in Package (PwrSiP)

Author(s): Declan Jordan, Guannan Wei, Liang Ye, Daniel Lordan, Pranay Podder, Ansar Masood, Kenneth Rodgers, Cian O Mathuna, Paul McCloskey
Published in: IEEE Journal of Emerging and Selected Topics in Power Electronics, Issue 9/1, 2021, Page(s) 102-110, ISSN 2168-6785
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/jestpe.2020.2983125

Characterization and enhancement of magnetic performance of electrodeposited Ni45Fe55 on PCB for high frequency application

Author(s): Z. Ghaferi, P. McCloskey
Published in: Journal of Magnetism and Magnetic Materials, Issue 505, 2020, Page(s) 166708, ISSN 0304-8853
Publisher: Elsevier BV
DOI: 10.1016/j.jmmm.2020.166708

Printing GaN HEMTs onto silicon CMOS

Author(s): Stefan Eisenbrandt and Ralf Lerner
Published in: Compound Semiconductor Magazine, 2018, ISSN 1096-598X
Publisher: Institute of Physics Publishing

Conference proceedings (11)

New Embedded Inductors For Power Converter Applications

Author(s): G. Weidinger, H. Stahr, A. Zluc, I. Salkovic, M. Schober, H. Takahashi, G. Weis, Ch. Vockenberger, S. Suchovsky
Published in: MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum”, Issue 16-17 May, 2018, 2018
Publisher: MiNaPad

Considerations on the Design Methodology for an Integrated Gate Driver

Author(s): N. Fiebig, G. Fischer, P. Ostrovskyy, D. Kissinger
Published in: ANALOG 2018; 16th GMM ITG-Symposium, Issue 13-14 September, 2018, 2018, Page(s) 131-135, ISBN 978-3-8007-4754-2
Publisher: VDE

Calculation, Simulation and Production of PCB-integrated Inductors with Focus on Fringing Effect

Author(s): Gerald Weis and Ivan Salkovic
Published in: PCIM Europe 2019, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2019, Page(s) 1-5, ISBN 978-3-8007-4938-6
Publisher: VDE

High Power Density DC-DC Converters Using Highly Integrated Half-Bridge GaN ICs

Author(s): Michael Basler, Stefan Moench, Richard Reiner, Fouad Benkhelifa, Gerald Weidinger, Gerald Weis, Rüdiger Quay, Ingmar Kallfass and Oliver Ambacher
Published in: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2021, Page(s) 1014-1021, ISBN 978-3-8007-5515-8
Publisher: VDE

PCB Embedded Transformer for Isolated DC-DC Power Supplies

Author(s): Gerald Weis and Ivan Salkovic
Published in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, Page(s) 1-5, ISBN 978-3-8007-5225-6
Publisher: VDE

PCB embedding of Magnetic Material for Inductor-based Applications

Author(s): Gerald Weis, Ivan Salkovic and Gerald Weidinger
Published in: International Microelectronics Assembly & Packaging Society (iMAPS), 16th Annual Device Packaging Conference (DPC 2020), Issue 2-5 March, 2020, 2020
Publisher: iMAPS

Design of Low-Resistance and Area-Efficient GaN-HEMTs for Low-Voltage Power Applications

Author(s): Richard Reiner, Fouad Benkhelifa, Stefan Moench, Michael Basler, Patrick Waltereit, Michael Mikulla, Rüdiger Quay and Oliver Ambacher
Published in: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2021, Page(s) 401-408, ISBN 978-3-8007-5515-8
Publisher: VDE

Qi compliant wireless charger with PCB integrated magnetic material

Author(s): Gerald Weis, Ivan Salkovic, Gerald Weidinger, Karl Kirchheimer, Ronald Sekavcnik, Johannes Stahr
Published in: 2019 IEEE Wireless Power Transfer Conference (WPTC), Issue 18-21 June 2019, 2019, Page(s) 203-207, ISBN 978-1-7281-0705-9
Publisher: IEEE
DOI: 10.1109/wptc45513.2019.9055647

PCB Embedded Toroidal Inductor for 2MHz Point-of-Load Converter

Author(s): Ruaidhrí Murphy, Zoran Pavlovic, Paul McCloskey, Cian Ó Mathúna, Séamus O’Driscoll and Gerald Weidinger
Published in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, Page(s) 280-285, ISBN 978-3-8007-5225-6
Publisher: VDE

GaNonCMOS H2020 Research: Sub-25V Switch Technologies for use in PwrSiP and PwrSoC

Author(s): Odhran Reidy and Séamus O’Driscoll
Published in: MCCI Annual Meeting 2017, Issue 2017, 2017
Publisher: MCCI

Thin-film magnetics-on-silicon integrated transformer for isolated power conversion applications

Author(s): Zoran Pavlovic, Pranay Podder, Dermot Dobbyn, Ansar Masood, Guannan Wei, Daniel Lordan, Paul McCloskey, Cian O’Mathuna and Séamus O’Driscoll
Published in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, Page(s) 264-268, ISBN 978-3-8007-5225-6
Publisher: VDE