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(Ultra)Sound Interfaces and Low Energy iNtegrated SEnsors

Objective

The SILENSE project will focus on using smart acoustic technologies and ultrasound in particular for Human Machine- and Machine to Machine Interfaces. Acoustic technologies have the main advantage of a much simpler, smaller, cheaper and easier to integrate transducer. The ambition of this project is to develop and improve acoustic technologies beyond state-of-the-art and extend its application beyond the mobile domain to Smart Home & Buildings and Automotive domains.
In this project, it will be proven that acoustics can be used as a touchless activation and control mechanism, by improvement or development of different smart acoustic technology blocks (hardware, software and system level) and integrate these blocks at system level.

At technology level, the SILENSE project will:
- Adapt and improve cost, performance, directivity and power consumption of (MEMS) acoustic transducers (incl. testing and qualification)
- Heterogeneously integrate arrays of acoustic transducers with other electronics, using advanced (3D) packaging concepts
- Develop smart algorithms for acoustical sensing, localization and communication
- Combine voice and gesture control by means of the same transducer(s)

At application level the SILENSE project will:
- Apply acoustical sensing for touchless activation/control of mobile devices, wearables and, more in general, IoT nodes.

The project links to Smart Systems Integration (B4), and refers also to application application-related topics, such as Smart Mobility and Smart Society. The application scope of the developed technologies is broader and comprises more societal domains, such as smart home/buildings, smart factories (i.e. Smart Production) and even Smart Health. Furthermore, a clear cross reference with Semiconductor Process, Equipment and Materials (B1) is established in view of the heterogeneous integration of technology blocks. Conventional silicon technologies will be combined with printed (flexible, large area electronics).

Fields of science (EuroSciVoc)

CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.

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Programme(s)

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Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

ECSEL-RIA - ECSEL Research and Innovation Action

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-ECSEL-2016-1-RIA-two-stage

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Coordinator

NXP SEMICONDUCTORS BELGIUM NV
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 523 437,50
Address
INTERLEUVENLAAN 80
3001 Leuven
Belgium

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Region
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 2 093 750,00

Participants (33)

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