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Simulation-Integrated Design and Development of 3D-Printed Shape Memory Polymer-Based Dynamic Electromagnetic Interference Shields

Project description

Dynamic electromagnetic interference shields: simulation prior to 3D printing

Electromagnetic interference (EMI) shielding protects electronic devices and systems from detrimental electromagnetic radiation. This protection is crucial in many sectors, including aerospace, military, medical and consumer electronics. EMI shielding has progressed from the simplest passive insulation, such as that used on electrical cables, to smart (active and dynamically responsive) concepts that change properties in response to changing threats. However, these concepts face significant technical challenges impeding commercialisation. With the support of the Marie Skłodowska-Curie Actions programme, the Sim3D-DynaShield project aims to combine mechanical, thermal and electromagnetic simulation with 3D printing to develop dynamic EMI shields. This will allow visualisation, design and analysis of performance before fabrication as well as the creation of complex geometries with precision.

Objective

Electromagnetic interference (EMI) shielding is the mitigation of unwanted electromagnetic (EM) radiation, which hinders the smooth operation of electronic systems. Over time, EMI shielding research has advanced from static to smart shielding, where the shields dynamically respond to external stimuli (pressure, temperature, etc), providing real-time protection. However, existing research on smart/dynamic EMI shielding materials faces challenges in precision, sustainability, and integration, limiting their real-world applications. Current solutions often rely on porous petroleum-based materials such as polyurethane polymers, which lack microstructure control and require constant exposure to stimuli to maintain the ON/OFF state. Further, the high resource requirements and lack of pre-fabrication optimization in current research demand innovation. This proposal aims to address these challenges by leveraging simulation-integrated 3D printing techniques to design and develop various microlattice mesh structures based on sustainable polycaprolactone shape memory polymer integrated with conducting and magnetic nanoparticles for enhanced smart shielding ability. This pioneering and innovative approach of combining mechanical, thermal and EM simulation with 3D printing allows visualization, designing and meticulous analysis before fabrication, enabling real-time assessment of material responses under various stimuli and the creation of complex geometries with precision. In this proposal, a smart shield integrated prototype system for real world applications will be developed, addressing the crucial research gap associated with realizing device-integrable smart shields in a resource-efficient and sustainable manner. My experience in EM simulation-oriented investigations for developing rigid to flexible EMI shielding structures and substantial knowledge on microwave materials, that I gained during my PhD, will significantly aid in producing tangible outcomes from this proposal.

Fields of science (EuroSciVoc)

Keywords

Programme(s)

Topic(s)

Funding Scheme

HORIZON-TMA-MSCA-PF-EF - HORIZON TMA MSCA Postdoctoral Fellowships - European Fellowships

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Call for proposal

(opens in new window) HORIZON-MSCA-2024-PF-01

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Coordinator

KATHOLIEKE UNIVERSITEIT LEUVEN
Net EU contribution
€ 216 240,00
Address
OUDE MARKT 13
3000 Leuven
Belgium
Region
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Activity type
Higher or Secondary Education Establishments
Links
Total cost
No data