Objective A new measurement instrument for the solderability of surface mounting electronic components was developed and is now being exploited commercially. In addition, a test procedure and guidance document have been written for submission to the relevant international CEN and IEC standards committees. A semi-quantitative predictive model of component solderability was produced. The effect of component solderability on solder fillet shape and hence on joint reliability was investigated. A set of solder joint fatigue data was produced for the different component types and different soldering processes. Programme(s) FP1-BRITE - Multiannual research and development programme (EEC) in the fields of basic technological research and the applications of new technologies (BRITE), 1985-1988 Topic(s) Data not available Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator National Physical Laboratory (NPL) EU contribution No data Address Queen's Road TW11 0LW Teddington United Kingdom See on map Total cost No data Participants (3) Sort alphabetically Sort by EU Contribution Expand all Collapse all Multicore Solders Ltd United Kingdom EU contribution No data Address HP2 4RQ Hemel Hempstead See on map Total cost No data Nederlandse Philips Bedrijven BV Netherlands EU contribution No data Address 5600 MD Eindhoven See on map Total cost No data SIEMENS AG Germany EU contribution No data Address Wittelsbacherplatz 2 MUENCHEN See on map Links Website Opens in new window Total cost No data
