Next-Generation Nanoelectronics Components and Electronics Integration The objective of CopPeR was to develop a seed-less copper deposition process and 300 mm wafer prototype equipment for sub-32 nm semiconductor interconnect manufacturing.
Field of science
- /engineering and technology/materials engineering/coating and films
- /humanities/arts/modern and contemporary art/film
- /natural sciences/chemical sciences/inorganic chemistry/inorganic compounds
Call for proposal
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Funding SchemeCP - Collaborative project (generic)