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Smart integration of GaN & SiC high power electronics for industrial and RF applications

Project description

Smart components and smart systems integration Packaging and thermal management in an efficient and cost effective way for SiC and GaN-based power devices

For industrial motor-drive, UPS and solar inverters applications and aerospace or telecom radio frequency applications, new emerging power semiconductor technologies, respectively SiC and GaN, have demonstrated their higher performances than the actual technologies (Si and GaAs) in terms of reduction of losses, increase of efficiency and power handling. But to increase the efficiency of the power modules and in the same time reduce their size and make them more cost effective, these SiC and GaN technologies still have to be associated with new efficient cooling and packaging solutions. The goal of the SMARTPOWER project is to carry out the packaging and thermal management developments required to achieve the efficient and cost-effective implementation of SiC- and GaN-based power modules into industrial power inverters and RF transmitters systems, respectively. This main objective is supported in the project by two routes of research. The first one of them is the developments of key enabling technologies required to the integration of the power modules into viable systems: efficient and reliable thermal interface materials and electrical interconnect, highly efficient thermoelectric modules and integrated temperature sensor. The second one is the development of new 3D packaging techniques and the associated thermal architectures that will allow to integrate the core chips, together with the enabling technologies, in a viable and cost effective manner. The RTD developments will be demonstrated into the realisation of two high power modules: a SiC-based inverter for UPS, solar and motor-drive applications as well as a GaN-based RF transmitter for aerospace and telecom applications. The SMARTPOWER consortium (15 partners from 7 European States) gathers all the competences required to achieve these objectives and involves all the supply chain partners in order to anticipate the cost-effective introduction of these new technologies and future products on the market.

Field of science

  • /social sciences/economics and business/business and management/commerce
  • /natural sciences/physical sciences/electromagnetism and electronics/electrical conductivity/semiconductor

Call for proposal

FP7-ICT-2011-7
See other projects for this call

Funding Scheme

CP - Collaborative project (generic)
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Coordinator

THALES
Address
Tour Carpe Diem Place Des Corolles Esplanade Nord
92400 Courbevoie
France
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
EU contribution
€ 939 460
Administrative Contact
Afshin Ziaei (Dr.)

Participants (14)

TAIPRO ENGINEERING SA
Belgium
EU contribution
€ 362 110
Address
Rue Du Bois Saint-jean 15/1
4102 Seraing Ougree
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Michel Saint-Mard (Mr.)
TECHNISCHE UNIVERSITAET CHEMNITZ
Germany
EU contribution
€ 284 400
Address
Strasse Der Nationen 62
09111 Chemnitz
Activity type
Higher or Secondary Education Establishments
Administrative Contact
Annett Kempe
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
EU contribution
€ 625 744
Address
Hansastrasse 27C
80686 Munchen
Activity type
Research Organisations
Administrative Contact
Christoph Schulte (Mr.)
INFINEON TECHNOLOGIES AG
Germany
EU contribution
€ 284 937
Address
Am Campeon 1-15
85579 Neubiberg
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Mingxia Wu-Lutzenberger (Ms.)
BERLINER NANOTEST UND DESIGN GMBH
Germany
EU contribution
€ 91 800
Address
Volmerstrasse 9 B
12489 Berlin
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Thomas Winkler (Dr.)
Micropelt GmbH
Germany
EU contribution
€ 186 247
Address
Emmy-noether-strasse 2
79110 Freiburg
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Oliver Keilhack (Mr.)
THALES DMS FRANCE SAS
France
EU contribution
€ 218 168
Address
2 Avenue Gay Lussac
78990 Elancourt
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Jean-Michel BESNIER (Mr.)
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
France
EU contribution
€ 568 946
Address
Rue Leblanc 25
75015 Paris 15
Activity type
Research Organisations
Administrative Contact
Stephanie THOLLON (Dr.)
SCHNEIDER ELECTRIC INDUSTRIES SAS
France
EU contribution
€ 193 381
Address
Rue Joseph Monier 35
92500 Rueil Malmaison
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Sylvain Paineau (Mr.)
IDRYMA TECHNOLOGIAS KAI EREVNAS
Greece
EU contribution
€ 267 975
Address
N Plastira Str 100
70013 Irakleio
Activity type
Research Organisations
Administrative Contact
Zinovia Papatheodorou (Ms.)
BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM
Hungary
EU contribution
€ 260 898
Address
Muegyetem Rakpart 3
1111 Budapest
Activity type
Higher or Secondary Education Establishments
Administrative Contact
Márta Rencz (Prof.)
INSTITUTUL NATIONAL DE CERCETAREDEZVOLTARE PENTRU MICROTEHNOLOGIE
Romania
EU contribution
€ 184 356
Address
Erou Iancu Nicolae Street 32B
077190 Voluntari
Activity type
Research Organisations
Administrative Contact
DOMNICA GEAMBAZI (Ms.)
CHALMERS TEKNISKA HOEGSKOLA AB
Sweden
EU contribution
€ 331 440
Address
-
41296 Goeteborg
Activity type
Higher or Secondary Education Establishments
Administrative Contact
Johan Liu (Prof.)
SHT SMART HIGH-TECH AB
Sweden
EU contribution
€ 275 138
Address
Fysikgrand 3
412 96 Goteborg
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Lilei Ye (Dr.)