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InP on SiN Photonic Integrated circuits REalized through wafer-scale micro-transfer printing

Project description

High-performance hybrid quantum photonic circuits

The EU-funded INSPIRE project aims to revolutionise the production of photonic integrated circuit technology by combining energy-efficient indium phosphide circuits and mass-manufactured silicon nitride photonic-based circuits using wafer-scale micro-transfer printing processes. This technology should align photonic circuits with accuracy better than 1 μm, leading to high-performance, low-cost photonic integrated circuits. INSPIRE technology will be validated in three different applications: a distributed fibre sensing readout unit suited to predictive maintenance in civil engineering and transportation, a microwave photonics radio-frequency pulse generator and an optical switch fabric to reduce the energy use of data centres.

Objective

INSPIRE aims to revolutionize photonic integrated circuit technology by combining two technologies, InP photonics and SiN photonics, in a single platform through wafer-scale micro-transfer printing technology. This platform will allow to combine high-performance III-V opto-electronic components (semiconductor optical amplifiers, high-speed phase modulators and photodetectors) operating in the C-band with the high-performance passive functionality of the SiN platform (high performance filters, 5dB/m waveguide loss), on 200mm wafers. The micro-transfer printing integration approach enables high-throughput integration of III-V devices on SiN photonic integrated circuits with better than 1 um alignment accuracy, resulting in high-performance, low-cost photonic integrated circuits. While being applicable in a wide range of mega-markets, the INSPIRE technology will be validated by three use cases: the case of a distributed fiber sensing readout unit based, the case of a microwave photonics RF pulse generator and a datacenter switch fabric. Compact models of the III-V opto-electronic components will be developed enabling designers to exploit this platform for a wide range of applications. INSPIRE will sustain Europe’s industrial leadership in photonics by combining the generic integrated foundry technology at the pioneering pure-play foundry SmartPhotonics, and the silicon photonics pioneer IMEC, with the micro-transfer printing technology at X-Celeprint, making this a world-first platform combining the strengths of all known PIC manufacturing platforms. It will also strengthen the European manufacturing base by developing and implementing processing steps that are key to removing expensive assembly steps in photonic IC based product realization. The methods will be developed for silicon nitride – indium phosphide integration. Since the optical coupling happens through a silicon intermediate layer the developed technology can be ported to silicon CMOS photonics as well.

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Programme(s)

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Topic(s)

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Funding Scheme

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RIA - Research and Innovation action

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Call for proposal

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(opens in new window) H2020-ICT-2018-20

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Coordinator

TECHNISCHE UNIVERSITEIT EINDHOVEN
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 812 653,75
Address
GROENE LOPER 3
5612 AE Eindhoven
Netherlands

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Region
Zuid-Nederland Noord-Brabant Zuidoost-Noord-Brabant
Activity type
Higher or Secondary Education Establishments
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 812 653,75

Participants (6)

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