Chip-on-board technology
2 July 1996 - 2 July 1996
Germany
A seminar on chip-on-board (COB) technology will be held in Berlin, Germany, on 2 July 1996. It is organized by VDI/VDE Technologiezentrum Informationstechnik GmbH, a German INNOVATION Relay Centre.
The aim of the seminar is to discuss the latest development results and trends in the field of COB technology on a European level. Demonstrations through innovative product solutions will show the advantages and performances of this application-specific interconnection and packaging technique. The seminar will also present the results of projects which aim to develop applications in multi-chip modules.
For further information, please contact:
VDI/VDE Technologiezentrum Informationstechnik GmbH
Mr. Schliesser
Rheinstrasse 10B
D-14513 Teltow/Berlin
Tel. +49-332-8435226; Fax +49-332-8435104
Information may also be found on the World Wide Web at:
http://www.vdivde-it.de/it/irc/events.html(opens in new window)
The aim of the seminar is to discuss the latest development results and trends in the field of COB technology on a European level. Demonstrations through innovative product solutions will show the advantages and performances of this application-specific interconnection and packaging technique. The seminar will also present the results of projects which aim to develop applications in multi-chip modules.
For further information, please contact:
VDI/VDE Technologiezentrum Informationstechnik GmbH
Mr. Schliesser
Rheinstrasse 10B
D-14513 Teltow/Berlin
Tel. +49-332-8435226; Fax +49-332-8435104
Information may also be found on the World Wide Web at:
http://www.vdivde-it.de/it/irc/events.html(opens in new window)