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Chip-on-board technology

A seminar on chip-on-board (COB) technology will be held in Berlin, Germany, on 2 July 1996. It is organized by VDI/VDE Technologiezentrum Informationstechnik GmbH, a German INNOVATION Relay Centre.

The aim of the seminar is to discuss the latest development results and trend...

2 July 1996 - 2 July 1996
Germany

A seminar on chip-on-board (COB) technology will be held in Berlin, Germany, on 2 July 1996. It is organized by VDI/VDE Technologiezentrum Informationstechnik GmbH, a German INNOVATION Relay Centre.

The aim of the seminar is to discuss the latest development results and trends in the field of COB technology on a European level. Demonstrations through innovative product solutions will show the advantages and performances of this application-specific interconnection and packaging technique. The seminar will also present the results of projects which aim to develop applications in multi-chip modules.
For further information, please contact:

VDI/VDE Technologiezentrum Informationstechnik GmbH
Mr. Schliesser
Rheinstrasse 10B
D-14513 Teltow/Berlin
Tel. +49-332-8435226; Fax +49-332-8435104

Information may also be found on the World Wide Web at:

http://www.vdivde-it.de/it/irc/events.html