Objective
This research project is a fundamental study of lead-free solders for ultra-fine pitch flip chip interconnects in microelectronic packaging, where immersion solder bumping in combination with electroless Ni-P under bump metallization (UBM) is used. Lead-free solders will replace Sn-37Pb in all electronic packaging in near future because of the environmental and healthy concerns. However, it offers a challenge to apply lead-free solders for flip chip interconnect in electronic packaging, due to the higher re flow temperatures and the higher Sn content associated with the lead-free solders, resulting a faster rate of dissolution and severe interfacial reactions between solder and the thin-film UBM.
Furthermore, this application is also under the pressure of continuously growing demand of higher density, smaller size and higher performance of chip technology. 0 Immersion solder bumping of lead-free solders is a good, flexible approach to meet ultra-fine pitch and volume production requirements. The study focuses on metallurgical interface reactions, dissolution rate of Ni-P into solders, electro-migration, mechanical properties and reliability issues of solder joints and identify failure mechanisms of ultra-fine pitch lead-free solder joints. The study is expected benefits for successful application of lead-free solders for "future realistic" ultra-fine pitch flip chip interconnects.
Fields of science (EuroSciVoc)
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP6-2004-MOBILITY-7
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Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
IIF - Marie Curie actions-Incoming International Fellowships
Coordinator
Germany
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.