Periodic Reporting for period 3 - MATQu (Materials for Quantum Computing)
Reporting period: 2023-06-01 to 2024-05-31
Enable the joint-development of participating European RTOs, material and tool providers, suppliers, and leading (application) companies to identify and advance the most promising emerging semiconductor technologies that can integrate the best materials for quantum computing and address the best-possible exploitation of the available infrastructure.
Evaluate current concepts for the application of materials for quantum computing according to Key Performance Indicators at the device, architecture, and application level, such as coherence time, variability, silicon area/cost, throughput of testing, manufacturing challenges, and operating frameworks.
Extend the materials and technology roadmap by evaluating and demonstrating the applicability of emerging technologies that can provide scalable qbit performance, and area benefits.
Broaden the applicability of materials for quantum computing, by (i) designing low-loss high quality substrates, (ii) by fabricating them in collaboration with European foundries and in European cleanrooms, and (iii) by benchmarking them in terms of performance, fidelity, and area in the context of pervasive applications that are provided by the end-user partners of the MATQu project.
Exchange wafers (flying wafers) between the participating RTOs to facilitate the demonstration of functional qbits, combining concepts from different RTOs and technologies. This will enable the more effective exploitation of the extensive know-how of European R&D organizations for future products and contamination-free high volume manufacturing.
Quantify the capability of the most prevalent materials for quantum computing implementations by targeting a broad approach to the resonator, interconnect, circuit, cabling, probing, and characterization equipment.
Complement existing research and provide guidance for future directions in the domain of quantum computing, design, and systems by assessing the suitability of emerging technologies. The aforementioned comparative evaluation of different materials and approaches can provide guidance to European quantum research, placing each approach in the context of emerging technologies and relevant applications.
Enable the European industry to maintain and expand its leading edge in materials and processes for quantum computer development.
Create a knowledge base for the key technology quantum computing as a key digital technology for societal advancement for the 21rst century. The results will impact the advancement of a European contribution to the advancements in logistics, chemistry, and energy consumption for advanced computing.
Evaluate current concepts for the application of materials for quantum computing according to Key Performance Indicators at the device, architecture, and application level, such as coherence time, variability, silicon area/cost, throughput of testing, manufacturing challenges, and operating frameworks.
Extend the materials and technology roadmap by evaluating and demonstrating the applicability of emerging technologies that can provide scalable qbit performance, and area benefits.
Broaden the applicability of materials for quantum computing, by (i) designing low-loss high quality substrates, (ii) by fabricating them in collaboration with European foundries and in European cleanrooms, and (iii) by benchmarking them in terms of performance, fidelity, and area in the context of pervasive applications that are provided by the end-user partners of the MATQu project.
Exchange wafers (flying wafers) between the participating RTOs to facilitate the demonstration of functional qbits, combining concepts from different RTOs and technologies. This will enable the more effective exploitation of the extensive know-how of European R&D organizations for future products and contamination-free high volume manufacturing.
Quantify the capability of the most prevalent materials for quantum computing implementations by targeting a broad approach to the resonator, interconnect, circuit, cabling, probing, and characterization equipment.
Complement existing research and provide guidance for future directions in the domain of quantum computing, design, and systems by assessing the suitability of emerging technologies. The aforementioned comparative evaluation of different materials and approaches can provide guidance to European quantum research, placing each approach in the context of emerging technologies and relevant applications.
Enable the European industry to maintain and expand its leading edge in materials and processes for quantum computer development.
Create a knowledge base for the key technology quantum computing as a key digital technology for societal advancement for the 21rst century. The results will impact the advancement of a European contribution to the advancements in logistics, chemistry, and energy consumption for advanced computing.
Highlights: Process of superconducting resonators on a wide variety of 300mm substrates (HR bulk and SOI). First benchmark of substrates and optimization of the substrates’ fabrication to reach targeted KPI (~15kOhm.cm).
Highlights: Successful integration of high performing qubits in Nb and all-Aluminum technology. Preliminary assessment of qubit variability within 6- inch to 12-inch wafers.
Highlights: Development of:
• Indium microbumps compatible with Qubits
• SC TSVs and cleaning Teflon residuals from Bosch process
• Wet etching seed layers of Cu, TiN, Nb, Au and Ru selectively to indium
• Electroplating indium microbumps on SC UBM layers on 300 and 200mm wafers
• Development of TCB and hybrid D2W bonding tools
• Cleaning and passivation of indium bumps prior to bonding
• Thick ALD TiN layer deposition as SC TSV
• Thermal aspects of stacked dies at cryo temperatures
• Resonators characterization on stacked dies
Highlights: Development of
High-density interfacing and calibration QPU control executed
• through CrioFlex cables demonstrated without performance degradation
• Developed low-heatload NbTi CrioFlex cables for integration in ADR cryostat.
Room-temp. elect. and SW for characterization
• Development of FPGA IP to accelerate signal generation for qubit control, enabling real-time feedback in the future
• Development of FPGA IP to accelerate readout signal demodulation via HW processing
• Development of off-the-shelf qubit tune-up and characterization routines
Sub-Kelvin ADR Cryostat
• Optimization of the cooling performance and the magnetic sample environment of the cryostat demonstrator
• Sucessful demonstration of the imporved cryostat performance
Data consolidation and benchmarking
• Successful wafer-scale cryogenic probing of Josephson junctions
• Developed methodology applied in CrioFlex characterization and wafer-level data analysis
Development of:
• A software library to simulate and characterize qubits by Atos
• A high-throughput sub-Kelvin characterization tool composed by Kiutra´s ADR Cryostat, Delft Circuits’ cryogenic cables, Keysight’s QCS (Quantum Control System) and Orange Quantum Systems’ characterization software.
• Hardware to interface classical HPC and quantum computers was developed by Mellanox, with the objective of speeding up some calibrations and characterization routines and, also, to perform quantum-classical computing in the future.
Highlights: Successful integration of high performing qubits in Nb and all-Aluminum technology. Preliminary assessment of qubit variability within 6- inch to 12-inch wafers.
Highlights: Development of:
• Indium microbumps compatible with Qubits
• SC TSVs and cleaning Teflon residuals from Bosch process
• Wet etching seed layers of Cu, TiN, Nb, Au and Ru selectively to indium
• Electroplating indium microbumps on SC UBM layers on 300 and 200mm wafers
• Development of TCB and hybrid D2W bonding tools
• Cleaning and passivation of indium bumps prior to bonding
• Thick ALD TiN layer deposition as SC TSV
• Thermal aspects of stacked dies at cryo temperatures
• Resonators characterization on stacked dies
Highlights: Development of
High-density interfacing and calibration QPU control executed
• through CrioFlex cables demonstrated without performance degradation
• Developed low-heatload NbTi CrioFlex cables for integration in ADR cryostat.
Room-temp. elect. and SW for characterization
• Development of FPGA IP to accelerate signal generation for qubit control, enabling real-time feedback in the future
• Development of FPGA IP to accelerate readout signal demodulation via HW processing
• Development of off-the-shelf qubit tune-up and characterization routines
Sub-Kelvin ADR Cryostat
• Optimization of the cooling performance and the magnetic sample environment of the cryostat demonstrator
• Sucessful demonstration of the imporved cryostat performance
Data consolidation and benchmarking
• Successful wafer-scale cryogenic probing of Josephson junctions
• Developed methodology applied in CrioFlex characterization and wafer-level data analysis
Development of:
• A software library to simulate and characterize qubits by Atos
• A high-throughput sub-Kelvin characterization tool composed by Kiutra´s ADR Cryostat, Delft Circuits’ cryogenic cables, Keysight’s QCS (Quantum Control System) and Orange Quantum Systems’ characterization software.
• Hardware to interface classical HPC and quantum computers was developed by Mellanox, with the objective of speeding up some calibrations and characterization routines and, also, to perform quantum-classical computing in the future.
Evaluation of Si Substrates for Qubit Integration
- 300 mm diameter highly-resistive silicon substrates evaluated & verified for specific needs of Qubits and low-loss resonator Qubit integration.
-> Being available for 300 mm Qubit production
Development and Success of Qubit Prototypes
Final prototypes demonstrated with relaxation times >100us
Variability evaluated across different wafer diameters and production sites
Qubits processed on multiple CMOS-compatible fabrication processes with novel integrations schemes
Advancements in 3D-Integration Technology
Evaluation and comparison of technology options for superconducting Qubits
At least one final technology option proven for application
Development of Advanced Cabling Solutions
Cabling solutions for use in characterization and application platforms developed
Novel cryo test probers developed and verified
Industrial-Level Measurement Platform
Measurement platform for the automatic testing of Qubits developed on an industrial level with advanced functionality
Transfer and product use
At least 5 future product platforms, starting from substrates, technology chemicals, cryo-probing solutions, and test and measurement equipment have been actively substantiated by scientific and engineering results. Several other product platforms have been actively supported in the value chain.
IPR
At least 11 patents submitted
At least 4 patents filed
At least 1 patent in writing
IPR pieces are being expected based on MATQu results
Demonstrators
14 demonstrators have been shown in the final review meeting.
Publications
An overall of so far 14 conference publications has been accepted, and another 9 journal papers have been submitted.
- 300 mm diameter highly-resistive silicon substrates evaluated & verified for specific needs of Qubits and low-loss resonator Qubit integration.
-> Being available for 300 mm Qubit production
Development and Success of Qubit Prototypes
Final prototypes demonstrated with relaxation times >100us
Variability evaluated across different wafer diameters and production sites
Qubits processed on multiple CMOS-compatible fabrication processes with novel integrations schemes
Advancements in 3D-Integration Technology
Evaluation and comparison of technology options for superconducting Qubits
At least one final technology option proven for application
Development of Advanced Cabling Solutions
Cabling solutions for use in characterization and application platforms developed
Novel cryo test probers developed and verified
Industrial-Level Measurement Platform
Measurement platform for the automatic testing of Qubits developed on an industrial level with advanced functionality
Transfer and product use
At least 5 future product platforms, starting from substrates, technology chemicals, cryo-probing solutions, and test and measurement equipment have been actively substantiated by scientific and engineering results. Several other product platforms have been actively supported in the value chain.
IPR
At least 11 patents submitted
At least 4 patents filed
At least 1 patent in writing
IPR pieces are being expected based on MATQu results
Demonstrators
14 demonstrators have been shown in the final review meeting.
Publications
An overall of so far 14 conference publications has been accepted, and another 9 journal papers have been submitted.