Materials for Quantum Computing

Project Information

MATQu

Grant agreement ID: 101007322

DOI

10.3030/101007322

Project closed

EC signature date 12 May 2021

Start date 1 June 2021

End date 31 May 2024

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost

€ 21 707 010,00

EU contribution

€ 6 548 524,39

Coordinated by

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Websites, patent fillings, videos etc. (2)

Launch of website

Launch of website FhG all partners contributing DEC PU M6 Task 61Task 62 Quarterly updates of websites

Press Release

Press Release FhG all partners contributing DEC PU M1 Task 61Task 62

Publications

Non-peer reviewed articles (1)

3D interconnects for quantum computing

Author(s): Jaber Derakhshandeh, Anish Dangol, Tassawar Hussain, Heiko Stegmann, A. M. Vadiraj, Prathamesh Dhakras, Thomas Witters, Ehsan Shafahian, Punith Kumar M K, Carine Gerets, Aleksandar Radisic, Aldrin Vaquilar, Aksel Goehnermeier, Danny Wan, Andy Miller, Anne Jourdain, Vladimir Cherman, Gerald Beyer, Eric Beyne and Kristiaan De Greve
Published in: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, ISSN 2377-5726
Publisher: IEEE
DOI: 10.1109/ectc51529.2024.00132

Peer reviewed articles (8)

Multiplexed superconducting qubit control at millikelvin temperatures with a low-power cryo-CMOS multiplexer

Author(s): Acharya, R., Brebels, S., Grill, A. et al. Multiplexed superconducting qubit control at millikelvin temperatures with a low-power cryo-CMOS multiplexer.
Published in: NATURE ELECTRONICS, 2023, Page(s) pages 900–909, ISSN 2520-1131
Publisher: NATURE
DOI: 10.1038/s41928-023-01033-8

High-coherence superconducting qubits made using industry-standard, advanced semiconductor manufacturing

Author(s): J. Van Damme, S. Massar1, R. Acharya1, Ts. Ivanov1, D. Perez Lozano1, Y. Canvel1, M. Demarets1,2, D. Vangoidsenhoven1, Y. Hermans1, J.G. Lai1, A. M. Vadiraj1, M. Mongillo1 , D.Wan1, J. De Boeck1,2, A. Potočnik1*, K. De Greve1,2
Published in: Nature, 2024, ISSN 2331-8422
Publisher: Cornell University
DOI: 10.48550/arxiv.2403.01312

Thermal resistance in superconducting flip-chip assemblies

Author(s): J. Hätinen, E. Mykkänen, K. Viisanen, A. Ronzani, A. Kemppinen, L. Lehtisyrjä, J. S. Lehtinen, M. Prunnila
Published in: Appl. Phys. Lett., 2023, ISSN 0003-6951
Publisher: American Institute of Physics
DOI: 10.1063/5.0162409

Developing TSV Wet Cleaning Chemistry for Quantum Computing Application

Author(s): Harold LE TULZO, Loriana CELESTE, Inès TENDERO, Jaber DERAKHSHANDEH, Carine GERETS, Candice THOMAS, Jean CHARBONNIER, Edouard DESCHASEAUX, Thierry LAZERAND, Jérôme DAVIOT
Published in: Microelectronic Engineering, Issue 276, 2023, Page(s) 112010, ISSN 0167-9317
Publisher: Elsevier BV
DOI: 10.1016/j.mee.2023.112010

300 mm CMOS-compatible superconducting HfN and ZrN thin films for quantum applications

Author(s): Roman Potjan, Marcus Wislicenus, Oliver Ostien, Raik Hoffmann, Maximilian Lederer, André Reck, Jennifer Emara, Lisa Roy, Benjamin Lilienthal-Uhlig, J. Wosnitza
Published in: Appl. Phys. Lett., 2023, ISSN 0003-6951
Publisher: American Institute of Physics
DOI: 10.1063/5.0176060

Argon-milling-induced decoherence mechanisms in superconducting

Author(s): J. Van Damme, Ts. Ivanov, P. Favia, T. Conard, J. Verjauw, R. Acharya, D. Perez Lozano, B. Raes, J. Van de Vondel, A. M. Vadiraj, M. Mongillo, D. Wan, J. De Boeck, A. Potočnik, K. De Greve
Published in: Physical Review Applied, Issue 20,1, 2023, Page(s) 14034, ISSN 2331-7019
Publisher: American Physical Society
DOI: 10.1103/physrevapplied.20.014034

Low-loss α-tantalum coplanar waveguide resonators on silicon wafers: fabrication, characterization and surface modification

Author(s): Daniel Pérez Lozano1, Massimo Mongillo2, Xiaoyu Piao3, Sebastien Couet4, Danny Wan1, Yann Canvel5, A. M. Vadiraj1, Tsvetan Ivanov1, Jeroen Verjauw1, Rohith Acharya1, Jacques Van Damme6, Mohiyaddin A. Fahd7, Julien Jussot8, Pallavi Puttarame Gowda1, Antoine Pacco1, Bart Raes1, Joris Van de Vondel9, Iuliana Radu10, Bogdan Govoreanu1, Johan Swerts4, Anton Potocnik11 and Kristiaan DeGreve1
Published in: IOP, 2024, ISSN 2633-4356
Publisher: IOP Publishing
DOI: 10.1088/2633-4356/ad4b8c

Effect of ion irradiation on superconducting thin films

Author(s): Katja Kohopää, Alberto Ronzani, Robab Najafi Jabdaraghi, Arijit Bera, Mário Ribeiro, Dibyendu Hazra, Emma Mykkänen, Jorden Senior, Mika Prunnila, Joonas Govenius, Janne S. Lehtinen, Antti Kemppinen
Published in: APL MAterials, 2024, ISSN 2166-532X
Publisher: Melville NY: AIP Publishing LLC
DOI: 10.1063/5.0202851

Conference proceedings (14)

Process Development and Characterization of Ru-based UBM for In Bumps Integration for Quantum Computing Applications

Author(s): Harold Le Tulzo, Diane Bijou, Thérèse Souza, Anthony Gallegos, Candice Thomas, Edouard Deschaseaux, Céline Feautrier, Jean Charbonnier, Alain Gueugnot, Jaber Derakhshandeh, Tassawar Hussain, Jérôme Daviot
Published in: 2024
Publisher: ECTC

Sustainable, highly efficient water based and NMP free through silicon vias cleaning for quantum computer interconnects integration

Author(s): Alexander M. Breul, Ronny Tepper, Jaber Derakhshandeh, Carine Gerets, Steffen Rosenow
Published in: 2022
Publisher: Linx Consulting Inc.

Single-qubit randomized benchmarking of flux-tuneable transmons – a test time analysis

Author(s): T. Last, Yevheniia Cheipesh, Konstantin Lehman, Vraj Patel, Sebastian Hähnle, Timo van Abswoude, Adam Lawrence, Anna Shchygol, Garrelt Alberts, and Adriaan Rol
Published in: 2024
Publisher: SPIE2024
DOI: 10.1117/12.3009887

Key ingredients for manufacturing superconducting quantum processors at scale

Author(s): Thorsten Last, Massimo Mongillo, Tsvetan Ivanov, Adriaan Rol, Adam Lawrence, Garrelt Alberts, Danny Wan, Anton Potocnik, Kristiaan de Greve,
Published in: 2023
Publisher: SPIE

3D interconnects for quantum computing

Author(s): Jaber Derakhshandeh, Anish Dangol, Tassawar Hussain, Heiko Stegmann, A. M. Vadiraj, Prathamesh Dhakras, Thomas Witters, Ehsan Shafahian, Punith Kumar M K, Carine Gerets, Aleksandar Radisic, Aldrin Vaquilar, Aksel Goehnermeier, Danny Wan, Andy Miller, Anne Jourdain, Vladimir Cherman, Gerald Beyer, Eric Beyne and Kristiaan De Greve
Published in: 2024
Publisher: ECTC

Accelerating resonator spectroscopy using microwave pulses

Author(s): O. Gargiulo, F. Rucker
Published in: 2024
Publisher: Quantum Matter Conference 2024

Superconducting hollow TSV for quantum computing

Author(s): Jaber Derakhshandeh, Roy Li, Geraldine Jamieson, Gabriela dos Santos, Bogdan Govoreanu, Andy Miller and Eric Beyne
Published in: 2023
Publisher: SSDM

Chemical Mechanical Polishing for indium pad damascene processing

Author(s): Karl Ceulemans, Ehsan Shafahian, Katia Devriendt, Herbert Struyf and Jaber Derakhshadeh
Published in: 2023
Publisher: SSDM

Fabrication of Superconducting Nb airbridges in a 300mm Pilot line for Quantum Technologies

Author(s): Danny Wan, Massimo Mongillo, Yann Canvel, Daniel Perez Lozano, Bert Tobback, Tsvetan Ivanov, Antoine Pacco, Xiaoyu Piao, Shana Massar, Anton Potočnik, and Kristiaan De Grev
Published in: IEEE, 2024
Publisher: IEEE

Through Silicon Vias cleaning for quantum computer interconnects integration

Author(s): Harold LE TULZO, Loriana CELESTE, Jaber DERAKHSHANDEH, Carine GERET2, Jean CHARBONNIER, Candice THOMAS, Edouard DESCHASEAUX, Jérôme DAVIOT
Published in: 2022
Publisher: SPCC

Investigations at low temperature of 90 nm pitch BEOL for quantum applications

Author(s): R. Segaud, P. Gergaud, S. Minoret, P. Neumann, F. Gustavo, A. Royer, C. Licitra, D. Mariolle, F. Nemouchi
Published in: 2022
Publisher: SPIE2023
DOI: 10.1109/iitc52079.2022.9881302

Electrochemical deposition of Indium bumps on Superconducting interconnect and thermo-compression bonding for cryogenic and quantum computing

Author(s): Kumin Kang, Jaber Derakhshandeh, Christian Wendeln, Ralf Schmidt, Hao-Yu , Ehsan Shafahian, Zaid El-Mekki, Tom Cochet, Masataka Maehara and Eric Beyne
Published in: 2023
Publisher: IEEE ECTC

Characterizations of indium interconnects for 3D quantum assemblies

Author(s): C. Feautrier, E. Deschaseaux, A. Gueugnot, J. Charbonnier, A. Plihon, L. Dupré, F. Henry, F. Berger, A. Pagot, S. Renet, O. Mailliart, C. Thomas
Published in: ECTC, 2023
Publisher: Proceeding of IEEE

300 mm metal and dielectric investigations for a superconducting Back-end of Line

Author(s): R. Segaud, P. Gergaud, S. Minoret, P. Neuman, F. Gustavo, A. Royer, F. Nemouchi
Published in: 2022
Publisher: MAM

Other (1)

Efficient electronic cooling above 2 K by niobium-based superconducting tunnel junctions

Author(s): J. Hätinen, A. Ronzani, R.P. Loreto, E. Mykkänen, A. Kemppinen, K. Viisanen, T. Rantanen, J. Geisor, J. Lehtinen, M. Ribeiro, J-P. Kaikkonen, O. Prakash, V. Vesterinen, W. Förbom, E.T. Mannila, M. Kervinen, J. Govenius, M. Prunnila
Published in: 2024
Publisher: ArXiv
DOI: 10.48550/arxiv.2403.08655

Thesis and dissertations (1)

Characterization and Optimization of Background Magnetic Field for the Operation of Quantum Circuits

Author(s): Apollon Marangos
Published in: 2024
Publisher: Technical University of Munich

Intellectual Property Rights

Patent (2)

QUANTUM BIT CHIP WITH STACKED WAFERS AND METHOD FOR FABRICATION THEREOF

Application/Publication number: 21 213080
Date: 2021-12-08
Applicant(s): INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Apparatus for mounting components on a substrate

Application/Publication number: 20 2318196661
Date: 2023-05-12
Applicant(s): BESI AUSTRIA GMBH