Development of New digital Microphone-MEMS-Sensors for wind tunnels with open/closed test sections and flight tests

Project Information

AEROMIC

Grant agreement ID: 101007958

DOI

10.3030/101007958

Project closed

EC signature date 6 December 2020

Start date 1 January 2021

End date 30 June 2023

Funded under

• SOCIETAL CHALLENGES - Smart, Green And Integrated Transport

Total cost

€ 1 749 710,00

EU contribution

€ 1 399 990,00

Coordinated by

SILICON AUSTRIA LABS GMBH
Austria

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Deliverables

Open Research Data Pilot (1)

DMP

Data Management Plan

Documents, reports (1)

PEDR

The plan for dissemination communication and exploitation of the results

Publications

Conference proceedings (10)

Signal conditioning design for aero-acoustic piezoelectric MEMS microphone arrays

Author(s): José A. García-Souto, Javier Lázaro-Fernández, Pablo Acedo
Published in: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022, ISBN 978-1-6654-9167-9
Publisher: IEEE
DOI: 10.1109/dtip56576.2022.9911756

Design and modeling of a novel piezoresistive microphone for aero acoustic measurements in laminar boundary layers using FEM and LEM

Author(s): Kolja J. Erbacher, Ha Duong Ngo, Piotr Mackowiak, Lixiang Wu, Emmanuel Julliard, Carsten Spehr
Published in: AIAA SciTech 2022 Forum, 2021
Publisher: AIAA
DOI: 10.2514/6.2022-1023

Piezoelectric MEMS for acoustic and ultrasonic applications

Author(s): Lixiang Wu; Tingzhong Xu; Javad Abbaszadeh; Mohssen Moridi
Published in: 2022 IEEE International Symposium on Applications of Ferroelectrics (ISAF) Proceedings, 2022, ISBN 978-1-6654-4841-3
Publisher: IEEE
DOI: 10.1109/isaf51494.2022.9870162

Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate

Author(s): Kolja Erbacher; Joao Alves Marques; Malte von Krshiwoblozki; Lixiang Wu; Ha Duong Ngo; Martin Schneider-Ramelow
Published in: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022
Publisher: IEEE
DOI: 10.1109/eptc56328.2022.10013281

Characterization of a Piezo-Resistive MEMS Microphone for Aero-Acoustic Measurements

Author(s): Kolja Erbacher, Onteru Lokesh, Claire Bourquard, Lixiang Wu, Piotr Mackowiak, Ha Duong Ngo, Martin Schneider-Ramelow
Published in: 2023 Sensor and Measurement Science International (SMSI) Proceedings, 2023, Page(s) 171-172, ISBN 978-3-9819376-8-8
Publisher: AMA Association for Sensors Measurement
DOI: 10.5162/smsi2023/c4.4

Design of dual-frequency piezoelectric MEMS microphones for wind tunnel testing

Author(s): Lixiang Wu, Xuyuan Chen, Ha Duong Ngo, Emmanuel Julliard, Carsten Spehr
Published in: AIAA SciTech 2022 Forum, 2021
Publisher: AIAA
DOI: 10.2514/6.2022-1021

Dual-frequency piezoelectric MEMS microphones based on AlSc30%N thin films for aeroacoustic measurements

Author(s): Lixiang Wu, Yanfen Zhai, Onteru Lokesh, Claire Bourquard, Javad Abbaszadeh, Nikolai Andrianov, Jose A. Garcia Souto, Thai Anh Tuan Nguyen, Xuyuan Chen, Kolja Erbacher, Ha-Duong Ngo, Olivier Sainges and Emmanuel Julliard
Published in: AIAA AVIATION 2023 Forum, 2023
Publisher: American Institute of Aeronautics and Astronautics, Inc.
DOI: 10.2514/6.2023-4391

Electronics design of piezo-resistive MEMS microphone arrays for aero-acoustics in flight test

Author(s): José A. García-Souto, Cindy Báez, Kolja J. Erbacher, Pablo Carrillo-Agudo, Ha Duong Ngo, Pablo Acedo
Published in: 2023 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2023
Publisher: IEEE
DOI: 10.1109/dtip58682.2023.10267950

Electronics for piezoelectric MEMS microphone arrays applied to aero-acoustic characterization ofstructures in wind tunnel tests

Author(s): Cindy A. Baez-Rivera, Jose A. Garcia Souto, Paula Cavarischia-Rega, Pablo Acedo
Published in: 10th ECCOMAS Thematic Conference on Smart Structures and Materials, 2023, Page(s) SS14 - Microsensors for aerospace applications
Publisher: ECCOMAS SMART2023
DOI: 10.7712/150123.9925.446129

A Novel Piezoresitive Microphone MEMS Sensor For Aerospace Applications

Author(s): Ha Duong Ngo, Kolja Erbacher, Lixiang Wu, Bei Wang, Zirui Pang, Julien Weiss, Pablo Acedo
Published in: 2022 IEEE International Conference on Electrical, Computer and Energy Technologies (ICECET) Proceedings, 2022, ISBN 978-1-6654-7087-2
Publisher: IEEE
DOI: 10.1109/icecet55527.2022.9872990