Modeling and simulation methodology for considering delamination and bonding pull out in a SiC MOSFET chip during the short-circuit phase
Author(s):
Alstom, Tarbes, France
Université de Pau & des pays de
l’Adour, E2S UPPA, SIAME,
Pau, France
yannick.dumollard@alstomgroup
.com
Emmanuel Batista
Alstom, Tarbes, France
emmanuel.batista@alstomgroup.
com
Laurent Pecastaing
Université de Pau & des pays de
l’Adour, E2S UPPA, SIAME,
Pau, France
laurent.pecastaing@univ-pau.fr
Jean-Marc Dienot
Université de Pau & des pays de
l’Adour, E2S UP
Published in:
2021
Publisher:
PEDG
Observation and simulation of dynamic humidity in power converters for railway applications due to moisture diffusion in plastics
Author(s):
Oskar Schuster, Andreas Nagel, and Bernd Laska
Siemens Mobility GmbH
Published in:
2021
Publisher:
EPE