Deliverables Documents, reports (1) Set up a dissemination and exploitation plan for the project Report defining the project dissemination communication and exploitation strategies Publications Conference proceedings (2) Modeling and simulation methodology for considering delamination and bonding pull out in a SiC MOSFET chip during the short-circuit phase Author(s): Alstom, Tarbes, France Université de Pau & des pays de l’Adour, E2S UPPA, SIAME, Pau, France yannick.dumollard@alstomgroup .com Emmanuel Batista Alstom, Tarbes, France emmanuel.batista@alstomgroup. com Laurent Pecastaing Université de Pau & des pays de l’Adour, E2S UPPA, SIAME, Pau, France laurent.pecastaing@univ-pau.fr Jean-Marc Dienot Université de Pau & des pays de l’Adour, E2S UP Published in: 2021 Publisher: PEDG Observation and simulation of dynamic humidity in power converters for railway applications due to moisture diffusion in plastics Author(s): Oskar Schuster, Andreas Nagel, and Bernd Laska Siemens Mobility GmbH Published in: 2021 Publisher: EPE Searching for OpenAIRE data... There was an error trying to search data from OpenAIRE No results available
