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Photonic Wafer-Level Integration Packaging and Test

Project description

DEENESFRITPL

Breakthrough photonic integrated and packaging technology

The EU-funded PhotonicLEAP project plans to develop a disruptive wafer-level photonic integrated circuit (PIC) module integration, packaging and test technology which can be scaled from low to very large volumes. The project will leverage the new developments to produce a surface mount technology (SMT) package that will incorporate for the first time multiple optical and electrical connections. PhotonicLEAP's SMT approach is set to become a new global standard for cost-effective PIC packaging and high-throughput PIC testing. The technologies will be validated in two state-of-the-art demonstrators: a high-speed optical communication module and a portable medical device for cardiovascular diagnostics. PhotonicLEAP's approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and opening completely new markets.

Objective

PhotonicLEAP will develop a disruptive wafer-level PIC module integration, packaging and test technology which can be scaled from low to very large volumes. PhotonicLEAP will use this disruptive technology to produce a revolutionary Surface Mount Technology (SMT) PIC package, which for the first time incorporates multiple optical and electrical connections. SMT is the most widely used, cost-effective and standardised package in the electronics world and PhotonicLEAP’s standardised SMT approach is set to follow, becoming a new global standard for cost-effective PIC packaging and high-throughput PIC testing. PhotonicLEAP will also develop standardised packaging design rules formalised into a Process Design Kit (PDK), providing users with easy access to the project technology through Open Access and commercial PIC design software tools. The project will validate these technologies through two state-of-the-art demonstrators, including a high-speed optical communication module and a portable medical device for cardio-vascular diagnostics. PhotonicLEAP’s approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and creating completely new markets. The project workplan includes high-quality measures to Exploit and Disseminate PhotonicLEAP’s results, including management of IP and research data, and to Communicate project activities to different target audiences. A key exploitation measure involves technology transfer to the flagship European PIC Packaging Pilot Line, PIXAPP, which has an extensive and growing user-base across multiple markets. PhotonicLEAP will be delivered by a highly experienced consortium with an unmatched record of excellence in developing and delivering many world firsts in PIC packaging, test technologies and advanced services. The consortium brings a wealth of interdisciplinary skills and state-of-the-art infrastructure to deliver on the project’s ambitious objectives.

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Call for proposal

H2020-ICT-2018-20

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Sub call

H2020-ICT-2020-2

Funding Scheme

RIA - Research and Innovation action

Coordinator

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Net EU contribution
€ 1 129 856,25
Address
WESTERN ROAD
T12 YN60 Cork
Ireland

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Region
Ireland Southern South-East
Activity type
Higher or Secondary Education Establishments
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Total cost
€ 1 129 856,25

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Last update: 27 December 2023

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Permalink: https://cordis.europa.eu/project/id/101016738

European Union, 2024