Photonic Wafer-Level Integration Packaging and Test

Project Information

PhotonicLEAP

Grant agreement ID: 101016738

DOI 10.3030/101016738

EC signature date 30 November 2020

Start date 1 January 2021

End date 31 December 2024

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost € 5 945 017,50

EU contribution € 5 945 017,50

Coordinated by

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

Deliverables

Documents, reports (2)

Project website, twitter account & social media

Project website twitter account social media profile TNI

First press release about PhotonicLEAP project

First press release about PhotonicLEAP project TNI

Publications

Conference proceedings (4)

Reference Thermal Chips for 2D and 3D Co-packaging Process Development

Author(s): P. Gupta et al.
Published in: 2023, ISBN 979-8-3503-3499-9
Publisher: IEEE
DOI: 10.1109/ectc51909.2023.00372

Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits

Author(s): M. Ghomashi, R. Baets and Y. Li
Published in: 2023, ISBN 979-8-3503-1429-8
Publisher: IEEE
DOI: 10.1109/nusod59562.2023.10273523

Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages

Author(s): P. Gupta et al.
Published in: 2022
Publisher: IEEE
DOI: 10.1109/estc55720.2022.9939531

High Aspect Ratio Through-Glass Vias as Heat Conductive Element

Author(s): K. Kröhnert et al.
Published in: 2022, ISBN 978-91-89711-39-6
Publisher: IEEE

Peer reviewed articles (3)

Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits

Author(s): Kamil Gradkowski; David Stegall; David Mackey; Alan Naughton; Terry Smith; Peter O'Brien
Published in: Journal of Lightwave Technology, 2023, Page(s) 3470-3478, ISSN 0733-8724
Publisher: Optical Society of America
DOI: 10.1109/jlt.2023.3239138

Integrated Photonics Packaging: Challenges and Opportunities

Author(s): Luigi Ranno, Parnika Gupta, Kamil Gradkowski, Robert Bernson, Drew Weninger, Samuel Serna, Anuradha Murthy Agarwal*, Lionel C. Kimerling, Juejun Hu*, and Peter OBrien*
Published in: ACS Photonics, 2022, ISSN 2330-4022
Publisher: American Chemical Society
DOI: 10.1021/acsphotonics.2c00891

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Author(s): Parnika Gupta, Amit Tanwar, Xiuyun He, Kamil Gradkowski, Kafil M. Razeeb, Padraic E. Morrissey, Peter O’Brien
Published in: JOURNAL OF OPTICAL MICROSYSTEMS, 2024, ISSN 1932-5150
Publisher: S P I E - International Society for Optical Engineering