Photonic Wafer-Level Integration Packaging and Test

Informations projet

PhotonicLEAP

N° de convention de subvention: 101016738

DOI

10.3030/101016738

Projet clôturé

Date de signature de la CE 30 Novembre 2020

Date de début 1 Janvier 2021

Date de fin 30 Septembre 2025

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coût total

€ 5 945 017,50

Contribution de l’UE

€ 5 945 017,50

Coordonné par

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

Periodic Reporting for period 2 - PhotonicLEAP (Photonic Wafer-Level Integration Packaging and Test)

Période du rapport: 2022-07-01 au 2023-12-31

Résumé du contexte et des objectifs généraux du projet

The EU-funded PhotonicLEAP project plans to develop a disruptive wafer-level photonic integrated circuit (PIC) module integration, packaging and test technology which can be scaled from low to very large volumes. The project will leverage the new developments to produce a surface mount technology (SMT) package that will incorporate for the first time multiple optical and electrical connections. PhotonicLEAP's SMT approach is set to become a new global standard for cost-effective PIC packaging and high-throughput PIC testing. The technologies will be validated in two state-of-the-art demonstrators: a high-speed optical communication module and a portable medical device for cardiovascular diagnostics. PhotonicLEAP's approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and opening completely new markets.

PhotonicLEAP will develop a disruptive wafer-level PIC module integration, packaging and test technology which can be scaled from low to very large volumes. PhotonicLEAP will use this disruptive technology to produce a revolutionary Surface Mount Technology (SMT) PIC package, which for the first time incorporates multiple optical and electrical connections. SMT is the most widely used, cost-effective and standardised package in the electronics world and PhotonicLEAP’s standardised SMT approach is set to follow, becoming a new global standard for cost-effective PIC packaging and high-throughput PIC testing. PhotonicLEAP will also develop standardised packaging design rules formalised into a Process Design Kit (PDK), providing users with easy access to the project technology through Open Access and commercial PIC design software tools. The project will validate these technologies through two state-of-the-art demonstrators, including a high-speed optical communication module and a portable medical device for cardio-vascular diagnostics. PhotonicLEAP’s approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and creating completely new markets. The project workplan includes high-quality measures to Exploit and Disseminate PhotonicLEAP’s results, including management of IP and research data, and to Communicate project activities to different target audiences. A key exploitation measure involves technology transfer to the flagship European PIC Packaging Pilot Line, PIXAPP, which has an extensive and growing user-base across multiple markets. PhotonicLEAP will be delivered by a highly experienced consortium with an unmatched record of excellence in developing and delivering many world firsts in PIC packaging, test technologies and advanced services. The consortium brings a wealth of interdisciplinary skills and state-of-the-art infrastructure to deliver on the project’s ambitious objectives.

Travail effectué depuis le début du projet jusqu’à la fin de la période considérée dans le rapport et principaux résultats atteints jusqu’à présent

To-date, the project has achieved a number of important technical milestones including design and fabrication of first glass interposers which form the substrate of the photonic BGA package. First drafts of the final project demonstrators to prove PhotonicLEAP’s technology, including the biomedical sensor and communication module, have been prepared and test structure fabricated. Work has started on optimising the packaging equipment and developing the innovative wafer-level packaging processes required to assemble the project demonstrators has started. This includes equipment to packaging novel micro-optical components and for laser soldering of photonic and electronic devices to the glass interposer substrate. Dissemination activities have focused on giving invited talks at leading international conferences and summited publications about development of the glass interposer technology. It is expected that dissemination activities will grow as more project results become available.

Progrès au-delà de l’état des connaissances et impact potentiel prévu (y compris l’impact socio-économique et les conséquences sociétales plus larges du projet jusqu’à présent)

PhotonicLEAP progresses state-of-the-art in PIC packaging and testing by developing a disruptive production technology using advanced glass packaging materials and fully automated wafer-level packaging and test processes which can be scaled to very large volumes. PhotonicLEAP will use this disruptive technology to produce a revolutionary Surface Mount Technology (SMT) PIC package, based on a Ball Grid Array (BGA) design. SMT is the most widely used, cost-effective and standardised package in the electronics world, and PhotonicLEAP’s standardised SMT approach is set to follow, becoming a new global standard for cost-effective PIC packaging. The PhotonicLEAP project addresses all aspects of PIC packaging, from efficient optical coupling, co-PIC, laser and electronic device integration, high-speed electrical interposers, efficient thermal management and reliable hermetic packaging. This will be achieved while delivering a dramatic reduction in the cost of packaging. PhotonicLEAP also develops a compatible high-throughput wafer-level test procedure which can be used before and after packaging. PhotonicLEAP also builds the early ecosystem to ensure this disruptive technology can be fully exploited. This includes optimised equipment for automated packaging and testing through to formalising packaging design rules in a standardised PDK. This approach will reduce the cost of PIC packaging, module integration and test production by over 10 times, opening up many new markets, overcoming the prohibitively expensive packaging solutions used today. This will cause significant market disruption, enabling the launch of new and affordable products powered by photonics, including; high-speed communication devices for future optical networks; biosensors for point-of-care patient monitoring – which are especially important given the global challenges we face with COVID-19; compact medical devices such as minimally invasive surgical and imaging systems; sensors for rapid and precise food safety and quality monitoring and in-line process control; miniaturised energy-efficient sensors for 5G, the Internet-of-Things and autonomous vehicles; high-speed quantum computing devices and augmented and virtual reality systems.

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