Photonic Wafer-Level Integration Packaging and Test

Informations projet

PhotonicLEAP

N° de convention de subvention: 101016738

DOI 10.3030/101016738

Date de signature de la CE 30 Novembre 2020

Date de début 1 Janvier 2021

Date de fin 31 Decembre 2024

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coût total € 5 945 017,50

Contribution de l’UE € 5 945 017,50

Coordonné par

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

Livrables

Documents, reports (2)

Project website, twitter account & social media

Project website twitter account social media profile TNI

First press release about PhotonicLEAP project

First press release about PhotonicLEAP project TNI

Publications

Conference proceedings (4)

Reference Thermal Chips for 2D and 3D Co-packaging Process Development

Auteurs: P. Gupta et al.
Publié dans: 2023, ISBN 979-8-3503-3499-9
Éditeur: IEEE
DOI: 10.1109/ectc51909.2023.00372

Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits

Auteurs: M. Ghomashi, R. Baets and Y. Li
Publié dans: 2023, ISBN 979-8-3503-1429-8
Éditeur: IEEE
DOI: 10.1109/nusod59562.2023.10273523

Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages

Auteurs: P. Gupta et al.
Publié dans: 2022
Éditeur: IEEE
DOI: 10.1109/estc55720.2022.9939531

High Aspect Ratio Through-Glass Vias as Heat Conductive Element

Auteurs: K. Kröhnert et al.
Publié dans: 2022, ISBN 978-91-89711-39-6
Éditeur: IEEE

Peer reviewed articles (3)

Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits

Auteurs: Kamil Gradkowski; David Stegall; David Mackey; Alan Naughton; Terry Smith; Peter O'Brien
Publié dans: Journal of Lightwave Technology, 2023, Page(s) 3470-3478, ISSN 0733-8724
Éditeur: Optical Society of America
DOI: 10.1109/jlt.2023.3239138

Integrated Photonics Packaging: Challenges and Opportunities

Auteurs: Luigi Ranno, Parnika Gupta, Kamil Gradkowski, Robert Bernson, Drew Weninger, Samuel Serna, Anuradha Murthy Agarwal*, Lionel C. Kimerling, Juejun Hu*, and Peter OBrien*
Publié dans: ACS Photonics, 2022, ISSN 2330-4022
Éditeur: American Chemical Society
DOI: 10.1021/acsphotonics.2c00891

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Auteurs: Parnika Gupta, Amit Tanwar, Xiuyun He, Kamil Gradkowski, Kafil M. Razeeb, Padraic E. Morrissey, Peter O’Brien
Publié dans: JOURNAL OF OPTICAL MICROSYSTEMS, 2024, ISSN 1932-5150
Éditeur: S P I E - International Society for Optical Engineering