InP on SiN Photonic Integrated circuits REalized through wafer-scale micro-transfer printing

Información del proyecto

INSPIRE

Identificador del acuerdo de subvención: 101017088

DOI 10.3030/101017088

Fecha de la firma de la CE 30 Noviembre 2020

Fecha de inicio 1 Enero 2021

Fecha de finalización 30 Junio 2024

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total € 4 982 281,75

Aportación de la UE € 4 982 281,75

Coordinado por

TECHNISCHE UNIVERSITEIT EINDHOVEN
Netherlands

Resultado final

Documents, reports (6)

Professional Communication Kit (first update)

communication requirements

Professional Communication Kit (second update)

communication requirements

Professional Communication Kit

Communication requirements

Dissemination and communication strategy

The definition of the dissemination and communication strategy and tools to be used during the life of the project All possible dissemination routes for the obtained results will be identified and used during the whole course of the project

Dissemination and communication strategy (first update)

The definition of the dissemination and communication strategy and tools to be used during the life of the project All possible dissemination routes for the obtained results will be identified and used during the whole course of the project

Dissemination and communication strategy (second update)

The definition of the dissemination and communication strategy and tools to be used during the life of the project All possible dissemination routes for the obtained results will be identified and used during the whole course of the project

Websites, patent fillings, videos etc. (1)

Project webpage

Description of the INSPIRE webpage that will be prepared in the first months of the project The website will be launched on eu domain

Publicaciones

Conference proceedings (2)

III-V-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing

Autores: Biwei Pan, Jerome Bourderionnet, Vincent Billault, Arnaud Brignon, Sarvagya Dwivedi, Marcus Dahlem, Cian Cummins, Sandeep S. Saseendran, Nga Pham, Philippe Helin, Nicolas Vaissière, Delphine Néel, Joan Ramirez, Jean Decobert, Johanna Rimböck, Ruggero Loi, Alin Fecioru, Emadreza Soltanian, Jing Zhang, Bart Kuyken, and Gunther Roelkens
Publicado en: OFC conference proceedings, 2023
Editor: OPTICA
DOI: 10.1364/ofc.2023.th3b.5

Design and analysis of high-density SOA arrays on indium phosphide

Autores: Reniers, S.F.G; Voorthuijzen, W.P.; Heck, M.J.R.; Jiao, Y.
Publicado en: IEEE Benelux symposium proceedings, 2023
Editor: IEEE
DOI: 10.5281/zenodo.8255587

Peer reviewed articles (3)

INSPIRE: InP on SiN photonic integrated circuits realized through wafer-scale micro-transfer printing

Autores: Heck, M. J. R.
Publicado en: Proceeding SPIE, vol. 12148, Edición Integrated Photonics Platforms II, 121480F, 2022, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.2631228

Bridging the gap between resonance and adiabaticity: a compact and highly tolerant vertical coupling structure

Autores: Yao, Chuhui; Cheng, Qixiang; Roelkens, Günther; Penty, Richard
Publicado en: Photonics Research, Edición Vol. 10, No. 9, 2022, Página(s) 2081-2090, ISSN 2327-9125
Editor: Optica publishing group
DOI: 10.1364/PRJ.465765

Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits

Autores: Roelkens, Gunther; Zhang, Jing; Bogaert, Laurens; Billet, Maximilien; Wang, Dongbo; Pan, Biwei; Kruckel, Clemens; Soltanian, Emad; Maes, Dennis; Vanackere, Tom; Vandekerckhove, Tom; Cuyvers, Stijn; De Witte, Jasper; Luntadila Lufungula, Isaac; Guo, Xin; Li, He; Qin, Senbiao; Muliuk, Grigorij; Uvin, Sarah; Haq, Bahawal; op de Beeck, Camiel; Goyvaerts, Jeroen; Lepage, Guy; Verheyen, Peter; Van Campe
Publicado en: Journal of Selected Topics in Quantum Electronics, 2022, ISSN 1077-260X
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/jstqe.2022.3222686