InP on SiN Photonic Integrated circuits REalized through wafer-scale micro-transfer printing

Informazioni relative al progetto

INSPIRE

ID dell’accordo di sovvenzione: 101017088

DOI 10.3030/101017088

Data della firma CE 30 Novembre 2020

Data di avvio 1 Gennaio 2021

Data di completamento 30 Giugno 2024

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale € 4 982 281,75

Contributo UE € 4 982 281,75

Coordinato da

TECHNISCHE UNIVERSITEIT EINDHOVEN
Netherlands

Risultati finali

Documents, reports (6)

Professional Communication Kit (first update)

communication requirements

Professional Communication Kit (second update)

communication requirements

Professional Communication Kit

Communication requirements

Dissemination and communication strategy

The definition of the dissemination and communication strategy and tools to be used during the life of the project All possible dissemination routes for the obtained results will be identified and used during the whole course of the project

Dissemination and communication strategy (first update)

The definition of the dissemination and communication strategy and tools to be used during the life of the project All possible dissemination routes for the obtained results will be identified and used during the whole course of the project

Dissemination and communication strategy (second update)

The definition of the dissemination and communication strategy and tools to be used during the life of the project All possible dissemination routes for the obtained results will be identified and used during the whole course of the project

Websites, patent fillings, videos etc. (1)

Project webpage

Description of the INSPIRE webpage that will be prepared in the first months of the project The website will be launched on eu domain

Pubblicazioni

Conference proceedings (2)

III-V-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing

Autori: Biwei Pan, Jerome Bourderionnet, Vincent Billault, Arnaud Brignon, Sarvagya Dwivedi, Marcus Dahlem, Cian Cummins, Sandeep S. Saseendran, Nga Pham, Philippe Helin, Nicolas Vaissière, Delphine Néel, Joan Ramirez, Jean Decobert, Johanna Rimböck, Ruggero Loi, Alin Fecioru, Emadreza Soltanian, Jing Zhang, Bart Kuyken, and Gunther Roelkens
Pubblicato in: OFC conference proceedings, 2023
Editore: OPTICA
DOI: 10.1364/ofc.2023.th3b.5

Design and analysis of high-density SOA arrays on indium phosphide

Autori: Reniers, S.F.G; Voorthuijzen, W.P.; Heck, M.J.R.; Jiao, Y.
Pubblicato in: IEEE Benelux symposium proceedings, 2023
Editore: IEEE
DOI: 10.5281/zenodo.8255587

Peer reviewed articles (3)

INSPIRE: InP on SiN photonic integrated circuits realized through wafer-scale micro-transfer printing

Autori: Heck, M. J. R.
Pubblicato in: Proceeding SPIE, vol. 12148, Numero Integrated Photonics Platforms II, 121480F, 2022, ISSN 1996-756X
Editore: SPIE
DOI: 10.1117/12.2631228

Bridging the gap between resonance and adiabaticity: a compact and highly tolerant vertical coupling structure

Autori: Yao, Chuhui; Cheng, Qixiang; Roelkens, Günther; Penty, Richard
Pubblicato in: Photonics Research, Numero Vol. 10, No. 9, 2022, Pagina/e 2081-2090, ISSN 2327-9125
Editore: Optica publishing group
DOI: 10.1364/PRJ.465765

Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits

Autori: Roelkens, Gunther; Zhang, Jing; Bogaert, Laurens; Billet, Maximilien; Wang, Dongbo; Pan, Biwei; Kruckel, Clemens; Soltanian, Emad; Maes, Dennis; Vanackere, Tom; Vandekerckhove, Tom; Cuyvers, Stijn; De Witte, Jasper; Luntadila Lufungula, Isaac; Guo, Xin; Li, He; Qin, Senbiao; Muliuk, Grigorij; Uvin, Sarah; Haq, Bahawal; op de Beeck, Camiel; Goyvaerts, Jeroen; Lepage, Guy; Verheyen, Peter; Van Campe
Pubblicato in: Journal of Selected Topics in Quantum Electronics, 2022, ISSN 1077-260X
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/jstqe.2022.3222686