Periodic Reporting for period 1 - ECOTRON (How to minimize the ecological footprint for functional electronics?)
Période du rapport: 2022-09-01 au 2023-08-31
A growing desire for continuous data collection, real time information and connectivity has resulted in increased demand for electronic functionalities that are fully integrated in everyday objects. Consumer electronics, healthcare, wearable electronics, IoT and smart packaging are examples of market segments that follow this trend. Printed circuit boards (PCBs) are the state of the art to create electronic functions. PCBs are processed on (non-recyclable), copper plated fibre reinforced epoxy (FR4). On these substrates, the electronic circuitry is created through chemical etching techniques, and electronic components (chips, SMDs, LEDs) are soldered at high temperature. Recycling and/or dismantling of the PCB is hardly done or occurs at very well-defined conditions and is mainly limited by metal recovery. As simultaneously the lifetime of such electronic products is decreasing (or are even becoming completely disposable), the environmental pressure rises exponentially, which requires dedicated climate actions to allow sustainable and responsible production and consumption of electronics. Flexible, organic & printed electronics (FOPE) is the preferred option to create sustainable electronics through low-energy, chemical-free and additive- manufacturing process and organic (recyclable) materials use.
In ECOTRON, flexible, organic & printed electronics are advanced through a multidisciplinary approach involving biobased materials, innovative (print) processes, and device and module dismantling technologies with the ultimate aim to improve the sustainability of products using printed electronics. Furthermore, recycling technologies and standards will be developed that are eventually integrated in a process design for a printed electronics recycling plant. Simultaneously, the lifetime of printed electronics is improved for larger implementation of printed electronics into everyday products. ECOTRON will create use-case demonstrators in existing state-of-the-art electronics products in consumer electronics, smart packaging, healthcare and wearable electronics market segments to demonstrate the potential environmental enhancements.
In ECOTRON, flexible, organic & printed electronics are advanced through a multidisciplinary approach involving biobased materials, innovative (print) processes, and device and module dismantling technologies with the ultimate aim to improve the sustainability of products using printed electronics. Furthermore, recycling technologies and standards will be developed that are eventually integrated in a process design for a printed electronics recycling plant. Simultaneously, the lifetime of printed electronics is improved for larger implementation of printed electronics into everyday products. ECOTRON will create use-case demonstrators in existing state-of-the-art electronics products in consumer electronics, smart packaging, healthcare and wearable electronics market segments to demonstrate the potential environmental enhancements.
INNOVATIVE DISMANTLING TECHNOLOGIES to enhance recycling:
1) Reversible interconnects based on Gecko tape (CEA), Reversible underfill with DA technology (TNO) and low temperature soldering (TNO) have been created and are implemented in use-cases
2) Dismantling processes: Sacrifice layer (TNO); Photonic ablation (TNO) are shown on prototype level.
3) Silver recollection techniques: Supercritical CO2 metal extraction (ITENE); Hydrometallurgy / solvometallurgy (TR) are shown on prototype level and most potential technology is selected.
BIOBASED / COMPOSTABLE MATERIALS as renewable and compostable alternatives for fossil based plastics:
1) Chemical recycling of polymers (POLIMI) have been realised and monomers are characterised.
2) Biobased substrates and monomers such as Biobased PET/ PEN alternatives (e.g. PLA, PEF, paper and CTA) (POLIMI) are created and are under evaluation
3) Improved PET, PLA and TPU biobased building blocks (pyrrole derivatives from triglycerides, pyrones from lignocellulosic material) (POLIMI) and Diels-Alder binder / composites (POLIMI/TNO) are introduced as sustainable alternatives.
4) Organic inks and varnishes: sp2 carbon allotropes based inks (POLIMI); Gelatin-based varnishes inks (ITENE) are under development
NOVEL PRINTING METHODS:
1) Reverse offset printing (VTT) for miniaturisation
2) Transfer foil method (VTT) for non volatile containing print method.
These technologies, based on their specifications and characteristics, are implemented and validated in the FOUR USECASES. Each use case partner is matched with one technology developer who leads the said use case:
1) Healthcare: On-body drug dosing device (BD & CEA) with printed electronics PCB system
2) Consumer electronics: LED luminaire (Signify & TNO) with printed electronics light foil;
3) Wearable electronics: Sport tracking chest strap (POLAR & VTT) with conductance printed strap
4) Smart packaging: Smart temperature sensors (Janssen & ITENE) with paper printed electronics
1) Reversible interconnects based on Gecko tape (CEA), Reversible underfill with DA technology (TNO) and low temperature soldering (TNO) have been created and are implemented in use-cases
2) Dismantling processes: Sacrifice layer (TNO); Photonic ablation (TNO) are shown on prototype level.
3) Silver recollection techniques: Supercritical CO2 metal extraction (ITENE); Hydrometallurgy / solvometallurgy (TR) are shown on prototype level and most potential technology is selected.
BIOBASED / COMPOSTABLE MATERIALS as renewable and compostable alternatives for fossil based plastics:
1) Chemical recycling of polymers (POLIMI) have been realised and monomers are characterised.
2) Biobased substrates and monomers such as Biobased PET/ PEN alternatives (e.g. PLA, PEF, paper and CTA) (POLIMI) are created and are under evaluation
3) Improved PET, PLA and TPU biobased building blocks (pyrrole derivatives from triglycerides, pyrones from lignocellulosic material) (POLIMI) and Diels-Alder binder / composites (POLIMI/TNO) are introduced as sustainable alternatives.
4) Organic inks and varnishes: sp2 carbon allotropes based inks (POLIMI); Gelatin-based varnishes inks (ITENE) are under development
NOVEL PRINTING METHODS:
1) Reverse offset printing (VTT) for miniaturisation
2) Transfer foil method (VTT) for non volatile containing print method.
These technologies, based on their specifications and characteristics, are implemented and validated in the FOUR USECASES. Each use case partner is matched with one technology developer who leads the said use case:
1) Healthcare: On-body drug dosing device (BD & CEA) with printed electronics PCB system
2) Consumer electronics: LED luminaire (Signify & TNO) with printed electronics light foil;
3) Wearable electronics: Sport tracking chest strap (POLAR & VTT) with conductance printed strap
4) Smart packaging: Smart temperature sensors (Janssen & ITENE) with paper printed electronics
-A reusable underfill material was developed using Diels Alder chemistry. A setup was made to apply these materials and proof of principle was demonstrated in the Gen #1 Signify use case. Further optimization on the current formulation should be done on the adhesion force which is currently 45% lower compared to the reference at room temperature. The next iteration of the Diels Alder underfill will include bio-based resins in the manufacturing process.
-To recycle SMT components a low temperature soldering method was developed. The method has a 5 to 10x lower resistance compared to the reference and a similar adhesive force. Further optimization will be done on the choice of materials and the processing method.
-Various combinations of substrates, conductive inks and sacrificial layers were disassembled using photonic ablation. Close to 100% removal of the circuitry was demonstrated using the optimal combinations. Further research will be on the removal of use case specific printed circuits and optimization of the process to do so.
-A Gecko effect tape was created to improve adhesion force from 2N/cm² (mold 1) to 8.6N/cm² (mold 5) at a peel pull-off speed of 1mm/min and 200 times attach/de-attach.
-A 100% biobased varnish based on gelatine has been developed at a sheet resistance of lower than 100 mΩ/sq, although print quality on PET should be improved.
-Gen #1 of all four use cases have been prepared. These include substitution of traditional electronics’ components with printed electronics and other modifications to reduce the number and amount of used components and materials.
-To recycle SMT components a low temperature soldering method was developed. The method has a 5 to 10x lower resistance compared to the reference and a similar adhesive force. Further optimization will be done on the choice of materials and the processing method.
-Various combinations of substrates, conductive inks and sacrificial layers were disassembled using photonic ablation. Close to 100% removal of the circuitry was demonstrated using the optimal combinations. Further research will be on the removal of use case specific printed circuits and optimization of the process to do so.
-A Gecko effect tape was created to improve adhesion force from 2N/cm² (mold 1) to 8.6N/cm² (mold 5) at a peel pull-off speed of 1mm/min and 200 times attach/de-attach.
-A 100% biobased varnish based on gelatine has been developed at a sheet resistance of lower than 100 mΩ/sq, although print quality on PET should be improved.
-Gen #1 of all four use cases have been prepared. These include substitution of traditional electronics’ components with printed electronics and other modifications to reduce the number and amount of used components and materials.