How to minimize the ecological footprint for functional electronics?

Informations projet

ECOTRON

N° de convention de subvention: 101070167

DOI

10.3030/101070167

Date de signature de la CE 15 Juin 2022

Date de début 1 Septembre 2022

Date de fin 31 Août 2026

Financé au titre de

• Digital, Industry and Space

Coût total

€ 4 999 000,25

Contribution de l’UE

€ 4 999 000,25

Coordonné par

NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Netherlands

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Websites, patent fillings, videos etc. (1)

Initial communication kit (website, factsheet, leaflet, etc.)

Webpage description of ECOTRON webpage prepared in the first months of the project Media kit including project promotional materials

Documents, reports (2)

Eco-design protocol for newly developed technologies to give sustainability direction to the novel technologies

This report will provides an eco-design protocol to create a standardized process for the evaluation of the circularity of printed electronics (Task 6.2-6.3). In total three iterations will be done for each technological advancement and for each iteration the protocol is executed

Sustainability evaluation procedure for compostable electronics

The circularity evaluation protocol is transferred into a standardisation process to evaluate compostability of printed electronics. A procedure to quantitatively measure the compostability of these products is designed using existing ISO, & OECD standards. All these tests will be conducted both on substrate level and product level

Publications

Peer reviewed articles (6)

Silk Sericin-Based Electrospun Nanofibers Forming Films for Cosmetic Applications: Preparation, Characterization, and Efficacy Evaluation

Auteurs: Ivana Dragojlov, Rony Aad, Diletta Ami, Marco Mangiagalli, Antonino Natalello, Simone Vesentini
Publié dans: Molecules, Numéro 30, 2025, ISSN 1420-3049
Éditeur: MDPI AG
DOI: 10.3390/MOLECULES30030715

Electroconductive Bionanocomposites from Black Soldier Fly Proteins for Green Flexible Electronics

Auteurs: Edoardo Testa, Vincenzina Barbera, Elisa Fasoli, Ulrich Giese, Maria Rosaria Belviso, Pasqua Rossini, Daniele Bruno, Gianluca Tettamanti, Marco Orlando, Gianluca Molla, Morena Casartelli, Maurizio Galimberti
Publié dans: ACS Sustainable Chemistry & Engineering, Numéro 13, 2025, ISSN 2168-0485
Éditeur: American Chemical Society (ACS)
DOI: 10.1021/ACSSUSCHEMENG.4C08242

Miniaturized Micrometer-Level Copper Wiring and Electrodes Based on Reverse-Offset Printing for Flexible Circuits

Auteurs: Kim Eiroma, Asko Sneck, Olli Halonen, Tuomas Happonen, Henrik Sandberg, Jaakko Leppäniemi
Publié dans: ACS Applied Electronic Materials, 2025, ISSN 2637-6113
Éditeur: American Chemical Society (ACS)
DOI: 10.1021/ACSAELM.5C00230

Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

Auteurs: Tuomas Happonen, Mikko Hietala, Arttu Huttunen, Terho Kololuoma, Markus Tuomikoski,
Publié dans: LEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings, 2023, ISSN 2832-8256
Éditeur: IEEE
DOI: 10.1109/FLEPS57599.2023.10220368

Sericin Protein: Structure, Properties, and Applications

Auteurs: Rony Aad; Ivana Dragojlov; Simone Vesentini
Publié dans: Journal of Functional Biomaterials, 2024, ISSN 2079-4983
Éditeur: MDPI
DOI: 10.3390/JFB15110322

Investigating resource productivity: the ecological potential of printed electronics as alternative to PCB

Auteurs: Marieke van Diemen, Jan Brusselaers, Corné Rentrop
Publié dans: Environmental Research Communications, Numéro 7, 2025, ISSN 2515-7620
Éditeur: IOP Publishing
DOI: 10.1088/2515-7620/AD9F0F