Project description
Efficient, low-cost photonic modules for terahertz sensing and quantum computing
Photonic integration technology is evolving from simple photonic integrated circuits towards more complex and versatile modules, which are unlocking new application areas. However, the technology has not yet reached cost-efficient production and compatibility with high-volume production, due to the lack of a simple, low-cost, wafer-scale compatible production process. The EU-funded POLYNICES project will develop a general-purpose electro-optic circuit board hosting silicon nitride chiplets, indium phosphide components and micro-optical elements, achieving a ten-fold decrease in photonic module production costs. Using this technology, POLYNICES will develop a fully integrated optoelectronic FMCW THz spectrometer with on-chip beam steering mechanism, a 16x16 quantum processor with integrated 780 nm light source and non-linear crystals, and a 24x24 quantum processor with integrated squeezed light state source.
Objective
Despite the significant advances that photonic integrated circuits (PICs) offer in terms of miniaturization, power consumption and functionalities, they run into scalability and cost issues, related to the fabrication yield, the increased integration and packaging complexity, the lack of wafer scale compatible processes and the lack of integration and packaging standards. Furthermore, so far photonic packaging considered the sub-GHz electrical connections to the PICs as a separate and second priority issue, until the number of electrical IOs of the PICs was too large to ignore. POLYNICES aims to address these challenges with the development of a novel general purpose photonic integration technology, compatible with wafer scale processes that will reduce the production costs of photonic modules by at least 10x. POLYNICES will develop for the first time a polymer based Electro-Optic PCB (EOPCB) motherboard that will host Si3N4 chiplets, InP components and micro-optical elements. POLYNICES invests in Si3N4 platform with PZT actuators to realize complex structures in only 1x1 cm2 chiplets with ultra-low power consumption. The chiplets’ grid array electrical pads and the use of flip-chip integration on vertical alignment stops will allow optical alignment and electrical connection in one step. The standard size and interfaces of the chiplets as well as the electronic IC co-packaging on the same EOPCB, provides excellent scalability and customization, and significantly simplifies packaging. Dielectric rod THz antennas will be integrated on the EOPCB taking advantage of its good HF properties. Using the above novel concepts and building blocks, POLYNICES will develop a fully integrated optoelectronic FMCW THz spectrometer with THz antenna array and beam steering abilities for quality control in plastics, a 16x16 quantum processor with integrated 780 nm light source and non-linear crystals and a 24x24 quantum processor with integrated squeezed light state source.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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HORIZON.2.4 - Digital, Industry and Space
MAIN PROGRAMME
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HORIZON.2.4.2 - Key Digital Technologies
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
HORIZON-RIA - HORIZON Research and Innovation Actions
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) HORIZON-CL4-2021-DIGITAL-EMERGING-01
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
106 82 ATHINA
Greece
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.