POLYmer based electro-optic PCB motherboard integration with Si3N4 Chiplets, InP Components and Electronic ICs enabling affordable photonic modules for THz Sensing and quantum computing applications

Informations projet

POLYNICES

N° de convention de subvention: 101070549

DOI 10.3030/101070549

Date de signature de la CE 7 Decembre 2022

Date de début 1 Janvier 2023

Date de fin 30 Juin 2026

Financé au titre de

• Digital, Industry and Space

Coût total € 4 963 702,00

Contribution de l’UE € 4 963 701,75

Coordonné par

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON
Greece

Livrables

Websites, patent fillings, videos etc. (2)

POLYNICES announcement (factsheet, short presentation, press release), Website and social accounts

The deliverable will report on setting up of the website and social media accounts for the announcement of POLYNICES

POLYNICES Promotion video presentation

The deliverable will report on the POLYNICES promotion video

Documents, reports (2)

Data Management Plan

The deliverable will report on the master Data Management Plan

Use cases, system requirements and KPIs of POLYNICES demonstrators

The report will focus on the use cases that will serve as guide for the design and development of POLYNICES technology demonstrators, and will identify the corresponding sets of system requirements and Key Performance Indicators (KPIs)