POLYmer based electro-optic PCB motherboard integration with Si3N4 Chiplets, InP Components and Electronic ICs enabling affordable photonic modules for THz Sensing and quantum computing applications

Informazioni relative al progetto

POLYNICES

ID dell’accordo di sovvenzione: 101070549

DOI 10.3030/101070549

Data della firma CE 7 Dicembre 2022

Data di avvio 1 Gennaio 2023

Data di completamento 30 Giugno 2026

Finanziato da

• Digital, Industry and Space

Costo totale € 4 963 702,00

Contributo UE € 4 963 701,75

Coordinato da

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON
Greece

Risultati finali

Websites, patent fillings, videos etc. (2)

POLYNICES announcement (factsheet, short presentation, press release), Website and social accounts

The deliverable will report on setting up of the website and social media accounts for the announcement of POLYNICES

POLYNICES Promotion video presentation

The deliverable will report on the POLYNICES promotion video

Documents, reports (2)

Data Management Plan

The deliverable will report on the master Data Management Plan

Use cases, system requirements and KPIs of POLYNICES demonstrators

The report will focus on the use cases that will serve as guide for the design and development of POLYNICES technology demonstrators, and will identify the corresponding sets of system requirements and Key Performance Indicators (KPIs)