Nanomechanical Hardware Platforms for Edge Computing

Project Information

i-EDGE

Grant agreement ID: 101092018

DOI

10.3030/101092018

EC signature date 13 October 2022

Start date 1 January 2023

End date 31 December 2026

Funded under

• Digital, Industry and Space

Total cost

€ 2 132 745,00

EU contribution

€ 2 132 745,00

Coordinated by

GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Germany

Periodic Reporting for period 2 - i-EDGE (Nanomechanical Hardware Platforms for Edge Computing)

Reporting period: 2024-07-01 to 2025-12-31

Summary of the context and overall objectives of the project

The proliferation of Internet of Things (IoT) applications across the aerospace, automotive, power generation, and manufacturing sectors—particularly within the circular economy—has necessitated the development of electronics capable of enduring extreme operating conditions. Conventional semiconductor-based electronics frequently fail in high-temperature or high-radiation environments. To address these limitations, the i-EDGE project introduces a novel Nanoelectromechanical (NEM) switch technology platform specifically engineered for resilient edge computing.

The i-EDGE platform leverages the physical properties of NEM switches to provide robust performance characteristics that surpass traditional CMOS limitations:
• Thermal Resilience: Reliable operation in ambient temperatures reaching 300°C.
• Radiation Hardness: Demonstrated resistance to ionizing radiation doses up to 1 Mrad.
• Energy Efficiency: The mechanical nature of the switches ensures zero standby power consumption, significantly optimizing the energy profile of edge nodes.

The project focuses on the development of a proof-of-concept System-on-Chip (SoC) demonstrator. This integrated IoT node is comprised of the following critical subsystems:
• NEM-based FPGA: A Field-Programmable Gate Array fabric utilizing NEM switches for reconfigurable digital logic.
• Non-Volatile Memory: Integrated memory arrays for persistent data storage in harsh conditions.
• Analog Utility Blocks: Modules for sensor data readout, signal conditioning, and data communication.
• Power Management: A high-temperature capacitor bank supported by a wireless power receiver for trickle-charging.
• Data Transceiver: An optimized transceiver for efficient telemetry and external interfacing.

Beyond hardware, i-EDGE will deliver a dedicated Physical Design Kit (PDK). This software suite will provide the necessary models for design and circuit simulation, streamlining the transition from conceptual architecture to physical implementation for application engineers.
Building upon foundational research (TRL 3), i-EDGE aims to advance this technology to Technology Readiness Level 5 (TRL 5). The technology will be validated through a functional condition-monitoring application tailored for industrial IoT processes.
The i-EDGE consortium encompasses a multidisciplinary supply chain, spanning from fundamental cell design to full-scale SoC integration. By establishing a roadmap for pilot manufacturing within Europe, the project directly supports the objectives of the EU Chips Act, enhancing regional sovereignty in specialized semiconductor design and high-endurance microelectronics.

Work performed from the beginning of the project to the end of the period covered by the report and main results achieved so far

Project Management:
• Continuous implementation of procedures for financial control, scientific progress tracking, and data management (FAIR principles).
• Tracking of intellectual property (IPR) rights and identification of Key Exploitable Results (KERs).

Technology Development:
• Adaption of system specifications to the project’s technical progress and input provided by its Business Interest Group (BIG)
• Optimization of all key components: NEM switches, non-volatile memory, FPGA, and utility circuits for wireless power, sensor data, and communication.

Design Tools:
• Maintenance and extension of the i-EDGE toolkit for designing and simulating circuits. This toolkit will be accessible to others even without deep knowledge of NEMS, promoting future use of the technology.

NEM Switch Advancement:
• Fabricated and tested various NEM switches (3, 4, and 7 terminals).
• Integrating NEM switches into existing manufacturing processes.
• Detailed discussion of options for small-scale manufacturing.

Commercialization:
• Feeback loop with Business Interest Group (BIG) to explore future uses and commercialization of the i-EDGE technology.

Deliverables & Milestones:
• All planned deliverables have been submitted in a timely manner
• All planned milestones have been reached

Progress beyond the state of the art and expected potential impact (including the socio-economic impact and the wider societal implications of the project so far)

Scientific Impact:
The i-EDGE project has established a robust scholarly foundation, with 6 manuscripts either appearing in or currently under preparation for high-impact, peer-reviewed journals in this reporting period, together with more than 10 conference conributions and additional communication and dissemnination activities. These contributions substantiate the project’s role in advancing the state-of-the-art in nanoelectromechanical (NEM) switch electronics. By disseminating these innovative methodologies and experimental results, the project actively redefines the technical boundaries of resilient microelectromechanical systems and high-temperature digital logic.

Beyond Academia:
The i-EDGE project maintains a strategic vision that transcends fundamental academic inquiry, prioritizing a robust pathway toward commercial industrialization. Central to this objective is the identification of high-value "incubator applications"—targeted, high-readiness implementations such as standalone non-volatile memory arrays for extreme environments. By deploying these specific initial use cases, i-EDGE demonstrates the empirical utility of NEM technology to secure industrial partnerships and venture capital. This integrated focus on scientific rigor and commercial viability positions the consortium to effectively bridge the "valley of death" between laboratory-scale research and scalable, market-ready microelectronic solutions.