Work Package 1: Semiconductor and packaging technologies development:
ST BiCMOS55X reached a mature level allowing more robust and reliable designs. Significant progresses have been made on the Bipolar performance and yield.
UMS GaN GH11-10 has frozen the technology content and improved the GaN transistor architecture. Models, electrical performance at device level and in representative circuit has been totally verified thanks the processing of a dedicated maskset (ASIREM). GH15 & GH25 have been widely used to support Run1 and are planned for Run2.
Advanced Packaging studies through Active Mold Packaging for mm-wave antennas made significant progresses with the simulation and fabrication of preliminary prototypes and the characterization of epoxy mold compound. Finally, 3D integration evaluation for mm-wave application made the characterization of a preliminary 3D mounted GaN die on substrate: assembly yield assessment, and electrical GaN transistor characteristics (DC & RF) were measured.
Work Package 2: Characterisation, modelling, and design environment enablement:
ST BiCMOS55X: DC, Low & High Frequencies (140 - 170GHz) electrical characterisation, self_Heating and RF Reliability assessments have been performed. Moreover, extensive exposure to radiations (including X, of assess devices & RF system have been done to assess their immunity. These measurements led to extract accurate models for the bipolar, key passive devices (inductors, varactors…) and improve Design Kits for designers.
UMS GaN S-parameters measurements up to 50 GHz were conducted on Individual transistors, with load-pull measurements at 45 GHz performed to expand gate development bandwidth for model extension. Additional characterization of specific devices was added in order to enable ISD to deliver their demonstrator (WP5, GH25). For UMS this period was essentially devoted to improve design kits for their most advanced GaN nodes in SHIFT (GH15 & GH10) and deliver them to the SHIFT design community.
Work Package 3: Backhaul Wireless & Fiber Optics telecommunication technologies
All three demonstrators made significant progresses. For all demonstrators of this Work Package (#1E&D-Band Phased Array Antenna Modules for 5G Backhaul, #2 High Speed Data transport for Optical communications, #3 Secured Data transmission over short distances), specifications and designs of key subblocks have been done and simulated with the latest Design Kit. This enabled to propose a full set of testchips started in fabrication in BiCMOS55X with “Buckle” MPW (Oct 2024). Antenna and associated packages have been also designed in parallel, including the test set-up and validation techniques.
Work Package 4: Fronthaul and Access wireless telecommunication technologies
All tasks mainly worked on achieving their specifications for the demonstrators and achieved the design of key subblocks that have been also simulated.
For Demonstrator#4 (Future G Transceivers), significant research on packaging solution have been also investigated in order to co-integrate in a single package an InP die with a BiCMOS55X. This has never been achieved in the market of G Transceivers.
Demonstration#5 (Sub 6G Transmitter FEM). Testchip (Doherty PA) have been processed in GH15 and delivered in order to prepare the co-integration of the chips with an SiGe HEMT Power Cell in an AMP Package.
Finally for the Demonstrator#6 (Digital Single Chip Transmitter), the architecture and the system specifications have been defined focusing on 6G evolution for the digital transmitter. Digital to Analog Convertors (DAC), Analog to Digital Convertors (ADC), and a Digital Pre-Distortion unit have been designed and simulated in parallel. The fabrication of the demonstrator is planned in the third period by accessing to a FDSOI 22nm process.
Work Package 5: Earth observation and satellite telecommunication technologies
Demonstrator#7 (AESA Antennas for X-Band Earth Observation from Low Orbital Satellites), innovative solutions are investigated and developed to ensure optimal performance.
Demonstrator#8 aims to develop an Electronically Steerable Ka-Band Array (ESKaA) for data downlink from onboard satellites for Earth Observation (EO). During this period, specifications of the system have been completed, technical requirements for critical elements defined.
Demonstrator#9 is the development of a GaN DC-DC converter with high efficiency, low power consumption, and robustness for space applications. During the second period, the architecture of the convertor has been confirmed (two phases serial buck convertor for the convertor). Both circuits have been launched in fabrication and will be received and tested during the third period.
Work Package 6: Impact assessments and enhancement: collaborative evaluation of the product carbon footprint impacts
The demonstrator for the carbon emission reduction methodology has been audited by a certified third party. The visibility of Carbon Hot Spots has been implemented. Finally, it has been developed and documented a concept for managing the emission reduction targets with suppliers
Work Package 7: Exploitation and dissemination, open science & data management
A Workshop by SHIFT members has been organized in the EuMW conference (September 2024), a book has been edited following this event. Finally SHIFT is currently collecting each partner exploitable plans.
