Periodic Reporting for period 1 - SHIFT (Sustainable tecHnologies enablIng Future Telecommunication applications)
Berichtszeitraum: 2022-12-01 bis 2023-11-30
The EU-funded SHIFT project plans to introduce new semiconductor technologies that will help develop the devices required by Beyond 5G/6G telecommunication standards. To this end, the project aims to develop and industrialize next-generation semiconductor technologies (SiGe BiCMOS for ST, RF GaN for UMS) and the associated integrated circuit design and characterization environments. The partners of the project will design innovative analog and digital RF integrated circuits using the technologies developed and integrate them as Front-End Modules (FEM) of innovative telecommunications system demonstrators. The project will also explore new assembly techniques that can solve RF signal integrity and heat dissipation issues or simplify RF systems.
● Work Package 1:
Regarding development of semiconductor technologies (SiGe BiCMOS B55X at ST and GaN GH15-10 and GH10-10 at UMS), important milestones have been achieved. For B55X, the technology reached TRL4 level (results in specifications); development activities of the technology have further allowed to reach the targets specified for the HBT, and optimization is going on. For the GH10-10, key technology steps which are epitaxy, ohmic contact and gate module, have been defined and optimized; activities for establishing a first design kit are on-going, encompassing extensive transistor characterization. The GH15-10 process that will be used for the SHIFT MMICs, is available for MPWs (Multi Project Wafers) runs. For both technologies, SiGe BiCMOS B55X and GH15-10, MPW runs for the 1st runs have been started.
Regarding packaging technologies, strategy and key materials for introduction of Active Mold technology have been defined, first molding trials realized and design activities are to be started to enable first laser and Cu structuring. For use in millimetre wave, studies have been started on antenna performance characterization.
Regarding 3D assembly of GaN to SiGe B55X MMICs, technical constraints have been analysed for assembly by copper pillars. A first test vehicle was defined, and trials realized.
● Work Package 2:
SiGe BiCMOS transistors from ST B55 technology have been studied under X-Ray irradiation (280 kRad), at DC conditions. Results have shown that the smaller the transistor the bigger the impact.
For characterization, definition of specific test benches for high frequency characterization (S-parameters, noise and power characterization above 110 GHz) has started, and a 140GHz set up is being optimized. Thermal impact studies on MOS transistors have been completed.
For the characterization and modelling, test structures have been designed, and definition of characterization benches initiated. High frequency characterizations of transistors, basic structures and more advanced designs for signal transmission, splitting, and matching have been performed up to 170 GHz.
First versions of B55X and GH15-10 PDKs have been delivered to partners. Legal requests induced unexpected delays for some partners utilizing B55X, which should pose a high risk to the finalization of 3 demonstrators.
● Work Package 3:
Demonstrator # 1: E- and D-band phased array antenna modules for 5G backhaul. Specifications have been defined and circuits designed in B55X have been delivered. Regarding the Antenna in Package, preliminary structure geometries and material stacks have been characterized. Regarding the Antenna in Module, the architecture has been defined.
Demonstrator # 2: High-speed/high-capacity data transport for optical communication in data centres and transport. Specifications have been defined. B55X PDK has been delivered after the RP1, which means that the demonstrator can only be carried out with an extension of the project.
Demonstrator # 3: Secure data transmission wireless backhaul over short distances. Specifications of the B55X MMIC and of the antenna have been defined. B55X PDK is under starting up late due to infrastructure issues.
● Work Package 4:
Demonstrator # 4: Future-G transceivers. Platform architecture, functional requirements and design specifications for the key building blocks have been defined. B55X PDK is lately released due to longer than anticipated legal agreement discussion for some partners.
Demonstrator # 5: Sub-6GHz GaN/SiGe transmitter front end module. The specification and design of the GaN MMIC has been realized, using the available PDK from UMS. The MPW run has been scheduled.
Demonstrator # 6: Digital single-chip MMIC TRX. The architecture and system specifications have been defined and consolidated with state-of-the-art analysis and preliminary characterizations. The technology has been chosen, but discussion on purchase cost of the Serdes IP is on-going.
● Work Package 5:
Demonstrator # 7: Earth observation in X band. Detailed specifications have been established at the system and MMIC level, main blocks (LNA, phase shifters, splitters) have been designed and simulated. LNA has been sent for 1st MPW run.
Demonstrator # 8: Electronically steerable ka-band array (ESKaA). Detailed specifications have been established at the system level and declined to the MMIC level. Regarding the PA, GaN designs have been realized, and for the antenna, a top-level design has been performed to select the most promising design/implementation option based on the system requirements. Regarding the B55X RF blocks (LNA and other RF blocks), their architectures have been defined, and designs have been realized. Activities on demonstrators’ definition have started.
Demonstrator # 9: Gan DC-DC converter. The specification requirements of the converter (functional and non-functional) have been defined. The circuit design phase has started with simulation from SPICE models, and ST’s BCD8s PDK release.
● Work Package 6:
CarbonBlock software has been realized, and requirements for the demonstrator defined.
First version of the demonstrator with basic functionality to exchange product carbon footprints along the supply chain has been realized, in close collaboration with the World Business Council for Sustainable Development (WBCSD) Partnership for Carbon Transparency (PACT) to ensure that the exchange is based on a global, open interoperable standard which allows later scalability of the approach. A first concept for the secure and software supported third-party proof of audit verification was developed and documented.
● Work Package 7:
SHIFT Logo has been designed and used on SHIFT Linkedin, ‘X’ and Zenodo accounts that were created. Website has been put online, and introduction video to SHIFT realized: the video recorded 2,000 views on Linkedin on 1st month. Guidelines for SHIFT Data Management (Plan) and Dissemination, Publication and Open Science practices have been made available. A 1st version of the exploitation plan has been delivered.
Regarding development of semiconductor technologies (SiGe BiCMOS B55X at ST and GaN GH15-10 and GH10-10 at UMS), important milestones have been achieved. For B55X, the technology reached TRL4 level (results in specifications); development activities of the technology have further allowed to reach the targets specified for the HBT, and optimization is going on. For the GH10-10, key technology steps which are epitaxy, ohmic contact and gate module, have been defined and optimized; activities for establishing a first design kit are on-going, encompassing extensive transistor characterization. The GH15-10 process that will be used for the SHIFT MMICs, is available for MPWs (Multi Project Wafers) runs. For both technologies, SiGe BiCMOS B55X and GH15-10, MPW runs for the 1st runs have been started.
Regarding packaging technologies, strategy and key materials for introduction of Active Mold technology have been defined, first molding trials realized and design activities are to be started to enable first laser and Cu structuring. For use in millimetre wave, studies have been started on antenna performance characterization.
Regarding 3D assembly of GaN to SiGe B55X MMICs, technical constraints have been analysed for assembly by copper pillars. A first test vehicle was defined, and trials realized.
● Work Package 2:
SiGe BiCMOS transistors from ST B55 technology have been studied under X-Ray irradiation (280 kRad), at DC conditions. Results have shown that the smaller the transistor the bigger the impact.
For characterization, definition of specific test benches for high frequency characterization (S-parameters, noise and power characterization above 110 GHz) has started, and a 140GHz set up is being optimized. Thermal impact studies on MOS transistors have been completed.
For the characterization and modelling, test structures have been designed, and definition of characterization benches initiated. High frequency characterizations of transistors, basic structures and more advanced designs for signal transmission, splitting, and matching have been performed up to 170 GHz.
First versions of B55X and GH15-10 PDKs have been delivered to partners. Legal requests induced unexpected delays for some partners utilizing B55X, which should pose a high risk to the finalization of 3 demonstrators.
● Work Package 3:
Demonstrator # 1: E- and D-band phased array antenna modules for 5G backhaul. Specifications have been defined and circuits designed in B55X have been delivered. Regarding the Antenna in Package, preliminary structure geometries and material stacks have been characterized. Regarding the Antenna in Module, the architecture has been defined.
Demonstrator # 2: High-speed/high-capacity data transport for optical communication in data centres and transport. Specifications have been defined. B55X PDK has been delivered after the RP1, which means that the demonstrator can only be carried out with an extension of the project.
Demonstrator # 3: Secure data transmission wireless backhaul over short distances. Specifications of the B55X MMIC and of the antenna have been defined. B55X PDK is under starting up late due to infrastructure issues.
● Work Package 4:
Demonstrator # 4: Future-G transceivers. Platform architecture, functional requirements and design specifications for the key building blocks have been defined. B55X PDK is lately released due to longer than anticipated legal agreement discussion for some partners.
Demonstrator # 5: Sub-6GHz GaN/SiGe transmitter front end module. The specification and design of the GaN MMIC has been realized, using the available PDK from UMS. The MPW run has been scheduled.
Demonstrator # 6: Digital single-chip MMIC TRX. The architecture and system specifications have been defined and consolidated with state-of-the-art analysis and preliminary characterizations. The technology has been chosen, but discussion on purchase cost of the Serdes IP is on-going.
● Work Package 5:
Demonstrator # 7: Earth observation in X band. Detailed specifications have been established at the system and MMIC level, main blocks (LNA, phase shifters, splitters) have been designed and simulated. LNA has been sent for 1st MPW run.
Demonstrator # 8: Electronically steerable ka-band array (ESKaA). Detailed specifications have been established at the system level and declined to the MMIC level. Regarding the PA, GaN designs have been realized, and for the antenna, a top-level design has been performed to select the most promising design/implementation option based on the system requirements. Regarding the B55X RF blocks (LNA and other RF blocks), their architectures have been defined, and designs have been realized. Activities on demonstrators’ definition have started.
Demonstrator # 9: Gan DC-DC converter. The specification requirements of the converter (functional and non-functional) have been defined. The circuit design phase has started with simulation from SPICE models, and ST’s BCD8s PDK release.
● Work Package 6:
CarbonBlock software has been realized, and requirements for the demonstrator defined.
First version of the demonstrator with basic functionality to exchange product carbon footprints along the supply chain has been realized, in close collaboration with the World Business Council for Sustainable Development (WBCSD) Partnership for Carbon Transparency (PACT) to ensure that the exchange is based on a global, open interoperable standard which allows later scalability of the approach. A first concept for the secure and software supported third-party proof of audit verification was developed and documented.
● Work Package 7:
SHIFT Logo has been designed and used on SHIFT Linkedin, ‘X’ and Zenodo accounts that were created. Website has been put online, and introduction video to SHIFT realized: the video recorded 2,000 views on Linkedin on 1st month. Guidelines for SHIFT Data Management (Plan) and Dissemination, Publication and Open Science practices have been made available. A 1st version of the exploitation plan has been delivered.
B55X results for the HBT have shown beyond the state of the art results on Ft/Fmax: 385/502 GHz, and noise figure of 0.64-dB at 0.82-V VBE and 20GHz