Photonic Integrated Circuits For Access System in Telecom

Project Information

PIC-FAST

Grant agreement ID: 101145256

DOI

10.3030/101145256

EC signature date 20 February 2024

Start date 1 March 2024

End date 28 February 2027

Funded under

• The European Innovation Council (EIC)

Total cost

€ 3 491 968,75

EU contribution

€ 2 444 378,10

Coordinated by

PICADVANCED, SA
Portugal

Periodic Reporting for period 1 - PIC-FAST (Photonic Integrated Circuits For Access System in Telecom)

Reporting period: 2024-03-01 to 2025-02-28

Summary of the context and overall objectives of the project

The rapid proliferation of internet technologies, coupled with the growing number of users and devices, and the escalating bandwidth demands of applications and services, are imposing an unsustainable burden on networks and network operators. Consequently, this is resulting in decreased speeds and connectivity, among other issues. In this context, the EIC-funded PIC-FAST project aims to develop photonic integrated circuits (PICs) containing optical components to enhance scalability, reliability and efficiency further. Leveraging advancements in PIC design using optical network units, the project will facilitate a substantial and cost-efficient expansion of bandwidth. It will demonstrate usability and reduce environmental impact compared to current alternatives.

Work performed from the beginning of the project to the end of the period covered by the report and main results achieved so far

The number of internet-enabled users, devices and bandwidth-hungry applications is increasing constantly, therefore, a new solution with less power consumption and more cost-effective – adopting the existing fibre optical network – is needed. Hence, to solve this technology barrier, photonic integrated circuits (PICs) are key.
The PIC-FAST project aims to achieve a 10Gbps technology solution (compliant with the NG-PON2 standard) on a commercial form-factor using PICs and integrating a microprocessor, thus combining the ONU and ONT into a single product. Besides the key advantages on energy efficiency, footprint and more available bandwidth to end-users, this approach will also open the path to the next generation optical technologies such as 25Gbps and 50Gbps.”

Progress beyond the state of the art and expected potential impact (including the socio-economic impact and the wider societal implications of the project so far)

As during this mid-term analysis, PIC-FAST has advanced the integration of photonic circuits for both NG-PON2 and 50G PON standards, by exploring multiple PIC architectures and hybrid silicon-photonics approaches, paired with bespoke electronics, pluggable packaging, and on-prototype MAC firmware - these efforts were showcased in a 40 Gbps NG-PON2 demonstration and a preliminary 50G PON proof of concept at OFC 2025, both of them first of a kind in the industry.  By the end of the project, we will deliver a completed, qualified and demonstrated transceiver that with less optical components volume – when compared to a conventional BOSA module –, meanwhile it is more efficient and still meeting the compliance with NG-PON2 and 50G PON standards, ready for production scale-up. These developments aim to lower operators cost, enabling a cost-effective solution of higher speed for millions of homes and businesses, reducing CO2 emissions annually, and foster socioeconomic gains - from enhanced remote healthcare and education to boost the European photonics ecosystem and high-skilled job creation.

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